This article introduces the process of solder paste technical printing, analyses the interrelated disfigurement in printing and cause, and puts forward the relevant solvent.
本文简述了锡膏印刷的工艺流程，分析印刷过程中造成的相关缺陷及其产生的原因，并提出了相应的解决方法。
The article introduces 0201/01005 assembly process, including PCB design, the selection of solder paste and placement control, etc.
文章从线路板设计、焊膏选择、贴装控制等几个方面浅谈0201/01005元件装配工艺技术。
This article focuses on the solder paste material what happens at the various stages of reflow, the profiles they generate and their effects on the various constituent materials of the solder paste.
该文集中在讨论焊膏在回流焊不同阶段中会发生些什么，产生的温度分布及其对焊接组成材料的影响等。
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