A joining method, a method of mounting a semiconductor package (PKG) using the same, and a substrate-joining structure prepared thereby are provided.
本发明提供了一种接合方法、采用该方法安装半导体封装(pkg)的方法以及由此制备的基底接合结构。
A semiconductor package substrate for preventing deformation mainly comprises a flexible dielectric layer, a plurality of pins, at least one reinforced metal pattern and a solder mask layer.
一种改善变形的半导体封装基板，主要包括一可挠性介电层、多数个引脚、至少一补强金属图案以及一防焊层。
This review introduces the program package LADIA for lattice distortion analysis and its application to semiconductor self-assembled quantum dot (QD) systems.
本综述介绍晶格畸变分析(LADIA)程序包及其在半导体自组装量子点(QD)系统中的应用。
Gantry robots are widely used for precision manufacturing tasks such as circuit board assembly and semiconductor end-package et al.
拱架机器人广泛地应用于各种精密制造领域，例如表面贴装设备、半导体后封装设备等。
Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor.
半导体器件，半导体晶片，芯片尺寸封装及制作和检测方法。
This paper describes the internal circuit of the DIP-CIB module, semiconductor chip technologies, package technologies and general purpose inverter design by using HVIC and the DIP-CIB module.
在此详细介绍了DIP -CIB模块的内部电路、半导体硅片技术、封装技术，以及如何配合专用的HVIC来实现通用变频器的小型化设计。
Samsung Electronics, a global leader in semiconductor and telecommunication has developed a 4gb multi-chip package (MCP) targeted at 3g mobile phones market.
三星电子公司，是全球领先的半导体和电信制定了一个4gb的多芯片封装(MCP)针对3g手机市场。
Semiconductor analysis with ANSYS tools often incorporates nonlinear behaviors, including package warpage, solder joint creep, fracture in through-silicon-via designs, fatigue and delimitation.
利用ANSYS工具，可以分析半导体的非线性特性，其中包括封装变形、焊接点蠕变以及过孔设计中的断裂、疲劳和层间开裂。
LED is the heart of a semiconductor chip, the chip is attached to one end of a stent, is the negative side, the other end of the power of the cathode, the entire chip package to be epoxy resin.
LED的心脏是一个半导体的晶片，晶片的一端附在一个支架上，一端是负极，另一端连接电源的正极，使整个晶片被环氧树脂封装起来。
Semiconductor diode is a PN junction together with the corresponding client leads and package composition shell.
二极管是由一个PN结加上相应的引出端并封装管壳构成的。
Bidding drawings of Package F01P of F68 Plant Project of Intel Semiconductor (Dalian) Co. , Ltd.
英特尔半导体（大连）有限公司F68号厂房项目F01P包招标图纸；
Bidding drawings of Package F01P of F68 Plant Project of Intel Semiconductor (Dalian) Co. , Ltd.
英特尔半导体（大连）有限公司F68号厂房项目F01P包招标图纸；
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