A joining method, a method of mounting a semiconductor package (PKG) using the same, and a substrate-joining structure prepared thereby are provided.

本发明提供了一种接合方法、采用该方法安装半导体封装(pkg)的方法以及由此制备的基底接合结构。

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A semiconductor package substrate for preventing deformation mainly comprises a flexible dielectric layer, a plurality of pins, at least one reinforced metal pattern and a solder mask layer.

一种改善变形的半导体封装基板，主要包括一可挠性介电层、多数个引脚、至少一补强金属图案以及一防焊层。

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This technology will enable a terabit (Tb) of data storage in a small package using just 8 semiconductor die (this is 128 GB since there are 8 bits per byte). 128 GB capacity may be a common capacity node for the next generation of flash memory based products.

FORBES: New Flash Memory Devices Will Lead to 128 GB Consumer Products and More Flash in Computer Systems

One possible inspiration for China's move could be "Buy America" provisions in this year's federal stimulus package, said Anne Craib, director of market research and international affairs for the Semiconductor Industry Association, another signatory.

WSJ: China's Curbs on Tech Purchases Draw Ire