The thermal stress distribution of SCSP in packaging process was studied by finite element method.
利用有限元法研究了堆叠芯片封装(SCSP)器件在封装工艺过程中的热应力分布。
A finite element modeling of SCSP was performed. The distribution of thermal stress of SCSP under temperature cycle was analyzed.
研究了温度循环载荷下叠层芯片封装元件(scsp)的热应力分布情况，建立了SCSP的有限元模型。
The results of passive hemagglutination method indicated that SCSP was probably produced by spleen cells of the host, but not from the cancer cells.
用反向间接血凝法检验结果表明，血清抑癌多肽可能由宿主脾细胞产生，而非来自癌细胞。
The results show that SCSP gel column chromatography elution curve for a single narrow symmetrical peak, explain for homogeneous components polysaccharide;
结果表明，SCSP凝胶柱层析洗脱曲线为单一狭窄对称峰，说明为均一组分多糖；
A multi agent architecture of enterprise supply chain system was presented. Based on it, MA SCSP, a development platform for enterprise supply chain systems was designed and implemented.
将多主体技术应用于供应链系统的开发，提出了一种基于多智能体的供应链系统结构，设计实现了基于多智能主体的企业供应链系统开发平台MASCSP。
The simulation value of solder joint thermal fatigue life is 1 052 circulations. The thermal fatigue life of solder joint in SCSP is lower than the single chip package (2 656 circulations).
SCSP的焊点热疲劳寿命模拟值为1 052个循环周，低于单芯片封装元件的焊点热疲劳寿命(2 656个循环周)。
The simulation value of solder joint thermal fatigue life is 1 052 circulations. The thermal fatigue life of solder joint in SCSP is lower than the single chip package (2 656 circulations).
SCSP的焊点热疲劳寿命模拟值为1 052个循环周，低于单芯片封装元件的焊点热疲劳寿命(2 656个循环周)。
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