The thermal stress distribution of SCSP in packaging process was studied by finite element method.
利用有限元法研究了堆叠芯片封装(SCSP)器件在封装工艺过程中的热应力分布。
A finite element modeling of SCSP was performed. The distribution of thermal stress of SCSP under temperature cycle was analyzed.
研究了温度循环载荷下叠层芯片封装元件(scsp)的热应力分布情况，建立了SCSP的有限元模型。
The results of passive hemagglutination method indicated that SCSP was probably produced by spleen cells of the host, but not from the cancer cells.
用反向间接血凝法检验结果表明，血清抑癌多肽可能由宿主脾细胞产生，而非来自癌细胞。
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