Provides an optimum temperature for soldering PCB throughout reflowing operation.
通过回流焊操作为焊接pcb提供最佳温度。
The packaging process of vacuum reflowing soldering using in MEMS micro-gyro packaging was built and realized.
实现了MEMS微陀螺仪的真空封装工艺并优化了工艺参数；
The impact of prebake temperature, reflow temperature and reflow time on the effect of pr reflowing is studied.
着重研究了光刻胶的前烘胶温度、回流温度、回流时间对回流效果的影响。
Through comparison testing of the surface of reflowing holes of the external-mix self-sucking pump, the best design is determined.
对外混式自吸泵的回流孔面积进行对比试验，确定最佳设计方案。
Through comparison testing of the surface of reflowing holes of the external-mix self-sucking pump, the best design is determined.
对外混式自吸泵的回流孔面积进行对比试验，确定最佳设计方案。
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