thermal reflowing process 热力再流动法
thermal reflowing 软熔发亮处理
reflowing rate of coronary artery 冠脉再通率
reflowing process 软熔处理
induction reflowing 感应软熔
However, the position of the solder joints formed (underneath the chip) after reflow means that visual inspection is impossible.
回流后在芯片下方形成焊点的位置表明,目检是不可能的。
参考来源 - 芯片级尺寸封装返修技术工艺评定Futhermore, the LF and Lb methods need shorter time and less consumption of energy than hot air reflow bonding(HR).
相比于热风再流焊(以下简称HR),所设计的激光局部加热方法具有键合时间短、能耗低等优点。
参考来源 - 钎料热界面材料LED芯片键合新方法研究I indicate the cause of researching into the rural labor reflow and summarize the major research contents.
这部分主要阐述了农村劳动力回流问题提出的原因以及本文的主要研究内容。
参考来源 - 农村转移劳动力回流问题研究·2,447,543篇论文数据，部分数据来源于NoteExpress
Provides an optimum temperature for soldering PCB throughout reflowing operation.
通过回流焊操作为焊接pcb提供最佳温度。
The packaging process of vacuum reflowing soldering using in MEMS micro-gyro packaging was built and realized.
实现了MEMS微陀螺仪的真空封装工艺并优化了工艺参数；
The impact of prebake temperature, reflow temperature and reflow time on the effect of pr reflowing is studied.
着重研究了光刻胶的前烘胶温度、回流温度、回流时间对回流效果的影响。
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