Electroplating industry circulation-filtering various plating solution.
电镀业循环过滤各类电镀液。
Plating solution surface tension is too large, wetting agents insufficient.
电镀溶液表面张力过大，湿润剂不足。
Electrochemical characteristics of the zinc plating solution are also studied.
同时研究了镀锌液的电化学特性。
Electroplating, coating metal anode, was oxidized to cationic into plating solution;
电镀时，镀层金属做阳极，被氧化成阳离子进入电镀液；
A method for applying an electroless plating solution to a substrate is also provided.
还提供一种将无电电镀液施加至基板上的方法。
Naphthol in sulphate plating solution of tin can be straightly determined by absorption spectrophotometry.
用吸光光度法直接测定了硫酸盐镀锡液中2 -萘酚的含量。
The chemical precipitation method is feasible for extending the life of electroless nickel plating solution.
采用化学沉淀法延长化学镀镍液寿命是切实可行的。
The ways to prevent iron brush plating solution from being oxidized during storage and working are described.
阐述电刷镀铁液贮存期间和刷镀过程中防氧化的方法。
Some additional salt can improve the deep plating solution, scattered ability, ability to create a fine plating.
有些附加盐还能改善镀液的深镀能力﹐分散能力﹐产生细致的镀层。
Optimiaed composition and concentration of plating solution, plating conditions are obtained through experiment.
通过实验，优选出了合适的镀液成分、浓度及施镀条件。
Suitable com- pound Ni electroplating or electroless Ni plating solution were chosen to make low stress Ni layer.
采用合适的电解镍液或化学镀镍液的配方来制取低应力镍层；
The dispersion mechanisms of nanometer particles respectively in the plating solution and coatings were researched.
探讨了纳米粉在镀液和镀层中能够均匀分散的机理。
The experimental results show that the nickel electroless plating solution was stable and the nickel coating obtained with...
这说明玻璃表面用镍活化以取代用钯活化是一种可行的方法。
This text simply introduce the technology for Sn-Ce-Ni alloy electroplating. Plating solution is stable. Coat quality is good.
本文简要介绍锡铈镍合金电镀工艺。本工艺镀液稳定，电镀层质量好。
Using molecular sieve type plating solution additive is very favorable to raising coat thickness, coat adhesion and its stability.
使用分子筛型镀液添加剂对提高镀层厚度、镀层结合力及其稳定性都非常有利。
The effects of C2N2H8 on the properties of copper brush plating solution and copper deposits are investigated in the present paper.
主要就乙二胺在电刷镀铜溶液中的作用及其对镀铜层性能的影响进行了试验研究。
The weight of copper plating solution in a unit volume was function of contents of cupric pyrophosphate and potassium pyrophosphate.
镀液单位体积的重量是焦磷酸钾和焦磷酸铜含量的函数。
The result shows that the nano-particle surface charge is negative and its diameter distribution is more wide in brush plating solution.
实验结果表明纳米颗粒在镀液中荷负电，其粒径分布较广；
The experimental results show that the nickel electroless plating solution was stable and the nickel coating obtained with the solutio...
这说明玻璃表面用镍活化以取代用钯活化是一种可行的方法。
The traditional process, the chrome plating solution the chromium acid as the foundation and sulfuric acid as catalyst, the ratio of 100 to 1.
传统的镀铬工艺，其电镀液以铬酸为基础，以硫酸作催化剂，两者的比例为100：1。
Through mathematical analysis, this paper set up an A-C mathematical model for measuring Ni2 + concentration in electroless nickel plating solution.
通过数学分析的方法建立起化学镀镍液的A - C数学模型。
The main treatment methods of spent electroless nickel plating solution include chemical deposition, catalytic reduction, electrolysis, ionic exchange, etc.
化学镀镍废液的处理方法主要有化学沉淀法、催化还原法、电解法、离子交换法等。
The new type of silver-plating solution without cyanogen is very stable, which is advantageous to the light and heat adaptability and foreign matter resistance.
新型无氰镀银溶液稳定，对光、热适应性和抗杂质干扰性都很好；对镀件适应范围宽；
In some cases, if the salt solution of the metal ion content for simple ion, the coating, therefore, coarse grains to adopt complexation ion of plating solution.
有些情况下﹐若镀液中主盐的金属离子为简单离子时﹐则镀层晶粒粗大﹐因此﹐要采用络合离子的镀液。
Comparison experiment results show that the failure is not caused by the permeation of plating solution but by the reaction happened in the electroless nickel plating.
通过对比实验发现，这些样品的失效不是由于镀液的渗透引起的，而是与化学镀镍过程中的化学反应有关。
Hot dip galvanized process flow: finished Pickling - washing - plating solution - drying - plating - cooling - Medicine - Cleaning - polishing - hot dip galvanized finish.
热镀锌工艺流程：成品酸洗-水洗-加助镀液-烘干-挂镀-冷却-药化-清洗-打磨-热镀锌完工。
Ct Series ATS ADDCOPPER deposition speed, the strongest combination of product, just flexible substrates recommend priority application of chemical copper plating solution.
ATSADDCOPPERCT系列中沉积速度快，结合力最强的产品，刚挠性基板应用中优先推荐的化学镀铜溶液。
Cathodic polarization curve and cyclic voltammetric curve of sulfate copper plating solution are determined with 1286 electrochemical interface and rotating disc electrode.
采用1286电化学接口及旋转圆盘电极测定了硫酸铜镀液阴极极化曲线和循环伏安曲线。
The component data of pearl nickel, bright nickel, acidic copper and brass plating solution in production were analyzed when the best result of the plating deposit obtained.
为了获得电镀的最佳结果，在生产中对珍珠镍、光亮镍、酸性铜和黄铜四种镀液的成分参数进行了统计分析。
Sodium sulfate and sodium phosphite are tending to be accumulated gradually in the solution during electroless nickel plating, which affect the life of the plating solution.
随着施镀的进行，化学镀镍液中的硫酸钠和亚磷酸钠的积累越来越多，从而影响镀液的使用寿命。
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