cyanide zinc plating solution 氰化锌电镀
cyanide copper plating solution 氰化镀铜 ; 氰化
semi-bright nickel plating solution 半光亮镍电镀
brush plating solution 电刷镀溶液 ; 刷镀溶液
electroless plating solution 化学镀液
Chrome Plating Solution 铬电镀液 ; 镀铬溶液
Hull trough test and TEM analysis indicated that covering power of plating solution improved, crystallite of plating is careful, luminous area is increased when we added the assembles chemical organic additives by oneself in the electrocoppering. It can nearly achieve the overseas dye’s effect.
赫尔槽实验和TEM分析研究结果表明：酸性电镀铜溶液中加入自配有机添加剂，镀液深镀能力较好，铜镀层晶粒细致，光亮面积增加，接近于国外染料的效果。
参考来源 - 有机添加剂在印制电路板镀铜中的作用及其工艺研究·2,447,543篇论文数据，部分数据来源于NoteExpress
Plating solution surface tension is too large, wetting agents insufficient.
电镀溶液表面张力过大，湿润剂不足。
Electrochemical characteristics of the zinc plating solution are also studied.
同时研究了镀锌液的电化学特性。
The chemical precipitation method is feasible for extending the life of electroless nickel plating solution.
采用化学沉淀法延长化学镀镍液寿命是切实可行的。
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