The effect of solvent property on MRR of SAS is discussed.
讨论了溶液性质对SAS竞聚率的影响。
Currently, the slurries used in CMP usually contain particles at nano scale to accelerate the material remove ratio (MRR) and to optimize the planarity.
目前，CMP的抛光液通常使用纳米级颗粒来加速切除和优化抛光质量。
Experimental results show that the material remove rate(MRR) increases with the increase of laminated depth and decreases with the increase of tool path overlap ratio.
研究结果表明工件的加工速度随着分层厚度的增加而增加，随着轨迹重叠率的增加而减小；
By the principle of reversal process, the formula of material removal rate (MRR) in wafer rotation grinding process is deduced. The relationship between MRR and the grinding parameters is given.
在反转法的原理上，建立了硅片自旋转磨削材料去除率的理论模型，推导了材料去除率公式，分析了磨削工艺参数与材料去除率的关系。
By the principle of reversal process, the formula of material removal rate (MRR) in wafer rotation grinding process is deduced. The relationship between MRR and the grinding parameters is given.
在反转法的原理上，建立了硅片自旋转磨削材料去除率的理论模型，推导了材料去除率公式，分析了磨削工艺参数与材料去除率的关系。
应用推荐