Porous silicon used as a sacrificial layer has some important applications in surface micromachining technology.
多孔硅作为一种牺牲层材料，在表面硅微机械加工技术中有着重要的应用。
Micro electro mechanical systems (MEMS) are the micro mechatronics fabricated by microelectronic technology and micromachining.
微电子机械系统(MEMS)是结合微电子技术和微机械加工技术制造而成的微型机电一体化系统。
In the area of manufacturing, lasers are used for drilling, cutting, joining, hardening, surface modification and micromachining.
在生产领域，激光可以用来钻孔、切割、连接、硬化以及进行表面改性和微加工。
Femtosecond laser micromachining has many potential applications due to its advantages, such as limited heat-affected zone and more precision machining.
飞秒激光微加工具有热影响区小和加工精度高的特点，在激光微加工领域具有潜在的应用价值。
Versatile micromachining methods can be used for membrane fabrication.
通用的微机械加工方法可以用于膜制造。
Wire electrochemical micromachining(WEMM) is a recent new method for micro-machining.
微细电化学线切割加工是最近出现的一种微细加工新方法。
Mechanism, characteristic and application of excimer laser micromachining are introduced.
介绍了准分子激光微加工的机理、特点和应用。
A fabrication process has been developed to form a polymer micro tip arrays using micromachining.
采用微加工工艺制备出一种聚合物微锥阵列。
Objective To establish direct-write laser method for micromachining immunoassay microfluidic chip.
目的建立微流控芯片的CO_2激光直接微加工方法。
Using micromachining technology, we also integrated micro-heater and temperature sensor on the chip.
利用微加工技术，我们还将微加热器和温度传感器集成到本芯片上。
This paper examines the possibility and necessity of using micromachining technology for sensor manufacturing.
讨论利用微机械加工技术制作传感器的可能性、必然性。
Surface micromachining USES select materials and both wet and dry etching processes to form the circuitry layers.
表面微机械加工使用选择的材料和干法和湿法蚀刻工艺以形成电路层。
Using bulk micromachining and silicon bonding we can achieve high-performance full-silicon sandwich accelerometer.
采用体微机械加工技术和硅硅键合技术可以实现高性能的加速度传感器。
The cutting edges may be formed by torsioning, cutting, grinding, machining, laser micromachining, or grit blasting.
刃口可通过扭转、切割、磨削、机械加工、激光显微机 械加工或喷钢砂处理形成。
The femtosecond laser micromachining technique has extensive application prospects in the field of photonic devices.
指出飞秒激光微加工在光子器件领域的有很好的应用前景。
The measuring results of the above sensors indicate that the micromachining is very important to improve their performances.
传感器性能的测试结果表明了微机械加工对提高传感器性能的重要性。
The micromachining process like photolithograph, electroplate and sputtering etc is adopted to fabricate the stator of MGELR.
采用了光刻、电镀、溅射等微细加工工艺制造了MGELR的定子。
The design and fabrication of a novel deformable mirror based on silicon micromachining technology was presented in this paper.
给出基于硅微加工技术的一种新型可变形反射镜的设计和加工方法。
This paper presents the characteristics of silicon micromachining resonance vacuum sensor and a vacuum meter utilizing this sensor.
文中介绍硅微机械谐振真空传感器的特点及配套研制的真空计。
A novel electrostatic actuated deformable mirror with continuous facet is designed and fabricated by using silicon bulk micromachining technology.
基于体硅微加工技术设计并制作了一种新型的采用静电驱动的连续面型可变形反射镜。
Compared with bulk micromachining, the surface micromachining has the advantages of low manufacturing cost and easy integration with CMOS circuits.
在加工工艺方面，与体微机械加工相比表面微机械加工具有工艺简单，容易与CMOS电路集成等优点。
This paper presented one single chip micro inertial measurement unit based on ordinary bulk micromachining process such as dissolved wafer process.
论文基于普通的体硅工艺设计实现了一个单片集成式硅微惯性测量组合。
Instead of surface sacrificial layer and bulk micromachining technique, using polymer as thermal isolation material decreases cost and improves yield.
以聚合物材料作为绝热材料，避免了表面牺牲层工艺和体加工技术，降低了成本、提高了成品率。
The invention discloses a method for accurately controlling exposure time by utilizing pulse laser, which is applied to the technical field of micromachining.
本发明是一种利用脉冲激光精确控制曝光时间的方法，用于微细加工技术领域。
This paper investigates one kind of micro heat pipe arrays (MHPA), which are fabricated by advanced silicon bulk micromachining and anodic bonding technology.
介绍了一种基于硅体加工技术以及阳极键合技术的微热管阵列。
Based on the detailed analysis of MEMS surface micromachining process, the data model of surface micromachining process was built by the process oriented method.
首先对MEMS表面加工工艺进行了详细的分析，采用面向过程的方法建立了表面工艺过程的统一模型。
In this paper, according to the characteristics of electrochemical micromachining (EMM), the impact factors of micro-hole array machining precision are analyzed.
从电解加工的特点出发，对影响微细阵列孔加工精度的因素进行了分析。
The characteristics and requests of micromachining for silicon based sensors are introduced. The conventional methods of si substrate microfabrication are briefly described.
叙述了硅基传感器微机械加工的特点和要求，简要说明了硅衬底微细加工的常用方法。
Four fundamental manufacturing technologies namely bulk micromachining, surface micromachining, moulding and wefar bonding are introduced for Micro Electro Mechanical System(MEMS).
介绍了微电子机械系统的四种基本制作技术，即本体微机械加工、表面微机械加工、铸模工艺和晶片键合工艺。
Four fundamental manufacturing technologies namely bulk micromachining, surface micromachining, moulding and wefar bonding are introduced for Micro Electro Mechanical System(MEMS).
介绍了微电子机械系统的四种基本制作技术，即本体微机械加工、表面微机械加工、铸模工艺和晶片键合工艺。
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