The copper alloy strip of lead frame is the fundamental material for integrate circuit.
引线框架用铜带是集成电路的重要基础材料。
This paper discusses the methods for improving surface characters of semiconduc-tive lead frame.
研究探讨了改善半导体引线框架材料表面特性的方法。
The punching process of the lead frame was analyzed, the multi-position progressive die was designed.
分析了引线框的冲压工艺性，设计出了多工位级进模。
The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).
该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。
The effects of surface electroplate pure copper on oxidation failure of lead frame copper alloys for IC package were investigated.
研究了在铜合金表面电镀纯铜层保护膜对铜合金引线框架氧化失效的影响。
The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.
引线框架电镀层的质量直接影响着钽电容器的可焊性，所以引线框架电镀层质量的测定方法至关重要。
Copper alloys for lead frame are becoming leading factor in the lead frame materials for IC, because of its high strength and high conductivity.
铜合金引线框架材料因其高强高导电性能而成为集成电路框架材料的主体。
A series of reliability experiments and analysis were operated on alloy and brass lead frame to compare their influences on components' performances.
为研究支架更替对器件性能和可靠性产生的影响，使用对比的方法，对合金支架和黄铜支架样品进行了一系列的可靠性试验和分析。
The invention can effectively use metal silver, reduces the cost, improves the bonding force between plastics and the lead frame, and achieves the purpose of anti-layering.
本发明可以有效利用金属银，降低成本，提高塑料与引线框架的结合力，达到防分层目的。
The traits of progressive die for IC lead frame have been introduced with emphasis on the ironing stage in layout design and stripping micro-adjustment, safety setup of the structure.
介绍了IC引线框架级进冲模的特点并着重讲述了其排样设计中的整形工位和模具结构中的卸料、微调和安全机构，可供精密级进冲模设计参考。
The punching process of the lead frame was analyzed, the multi-position progressive die was designed. and the technology points of die design and manufacture were introduced in detail.
分析了引线框的冲压工艺性，设计出了多工位级进模。并详细介绍了模具设计制造的技术要领。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。
Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。
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