As a key part of integrated circuit, the lead frame has been greatly developed in recent years.
作为集成电路中关键的一个组成部分,近年来引线框架材料得到了极大发展。
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The copper alloy strip of lead frame is the fundamental material for integrate circuit.
引线框架用铜带是集成电路的重要基础材料。
This paper discusses the methods for improving surface characters of semiconduc-tive lead frame.
研究探讨了改善半导体引线框架材料表面特性的方法。
The punching process of the lead frame was analyzed, the multi-position progressive die was designed.
分析了引线框的冲压工艺性,设计出了多工位级进模。
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