In large scale integrated chip field, the IC of BGA encapsulation was widely used.
在大规模集成芯片中以BGA(球栅阵列)封装的IC芯片被广泛使用。
Experimental result shows that the performance of encapsulation adhesive tape trial-manufactured meets the demand of encapsulating quality and process of IC card.
实验结果表明，试制的封装胶带满足IC卡封装质量与工艺要求。
Experimental result shows that the performance of encapsulation adhesive tape trial-manufactured meets the demand of encapsulating quality and process of IC card.
实验结果表明，试制的封装胶带满足IC卡封装质量与工艺要求。
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