In large scale integrated chip field, the IC of BGA encapsulation was widely used.
在大规模集成芯片中以BGA(球栅阵列)封装的IC芯片被广泛使用。
Experimental result shows that the performance of encapsulation adhesive tape trial-manufactured meets the demand of encapsulating quality and process of IC card.
实验结果表明，试制的封装胶带满足IC卡封装质量与工艺要求。
Dispensing equipment can also be used in composite paper tub of coating, radio, IC board encapsulation and improve process means.
点胶设备还可应用于复合纸盆的涂装，无线电、IC板的封装等提高工艺手段。
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