Microsoft Word - 50.doc 关键词： 运动控制；可编程序控制器；集成电路封装；切片机 [gap=1057]Key words: Kinetic control; PLC; IC encapsulation; wafer incision device
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In large scale integrated chip field, the IC of BGA encapsulation was widely used.
在大规模集成芯片中以BGA(球栅阵列)封装的IC芯片被广泛使用。
Experimental result shows that the performance of encapsulation adhesive tape trial-manufactured meets the demand of encapsulating quality and process of IC card.
实验结果表明，试制的封装胶带满足IC卡封装质量与工艺要求。
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