That helped push bond prices and gold sharply higher.
这些措施有助于推动债券价格和黄金价格急剧上涨。
ELEMENTAL MERCURY: The "quicksilver" pictured here in a miner's hand is used to bond to gold in a slurry.
汞元素：画面中矿工手上的“水银”放入泥浆中用来和金结合。
Although the gold price fell and bond yields rose in October, the underlying contradiction didn't disappear.
尽管十月份金价下跌，国债收益率上涨，潜在的矛盾丝毫不散。
When gold was at its real all-time high in 1980, the ten-year Treasury-bond yield was 10.8%.
在1980年，黄金价格处于最高水平时，10年国债收益率为10.8%。
But gold generates no income. It is, in a sense, a perpetual zero coupon bond. So valuing it isn't easy.
但黄金不能带来收入。从某意义来说，黄金是一种永续的零息债券。因此对其进行估值并不容易。
To simulate the long gold wire and large bond pad, an equivalent method was presented in thermal analysis.
为了用较小的规模模拟相对较长的金线和较大的焊盘，提出了一种温度场分析的等效方法。
Treasury bond prices rallied, lowering the corresponding yields, and gold prices flirted with record highs as investors sought safety in hard assets.
国债价格上升，相应收益率下降。由于投资者寻求安全资产以避险的要求，金价得以创记录的上涨。
Diphenylthiourea were assembled onto the gold electrode surface with Au-S bond to form a diphenylthiourea self-assembled monolayers(SAMs) Au electrode.
藉金硫键将二苯基硫脲组装在金电极上，形成二苯基硫脲自组装膜电极。
Meanwhile, the stock market has been in the grip of bears for years; and the immature bond, securities and fund sectors highlight the value of gold.
同时，股市好几年都处于熊市而难于脱出，与未充分发育的债券、证券、和基金领域对比，黄金更显出它的价值。
The gold bugs saw QE as inflationary, equity enthusiasts saw the tactic as boosting growth and the bond markets had the comfort that the Fed would be the "buyer of last resort" for Treasuries.
囤积黄金的视量化宽松为通胀，股票发烧友视其为刺激增长的手段，而债券市场中人放心于联储能够充当国债的“最后购买人”。
To regulate financial markets, including the inter-bank lending market, the inter-bank bond market, foreign exchange market and gold market;
监督管理银行间同业拆借市场和银行间债券市场、外汇市场、黄金市场。
By controling the three-dimensional motion of the X-Y table and bond head, precision positioning and desired line-type gold wires can be realized, and an ultrasonic wave bonded method is used.
工作原理是通过X-Y工作台和焊头的三维运动控制，定位并拉出设定的金丝线型，采用超声波热压球焊方法焊接芯片管脚。
By controling three-dimensional motion of the X-Y table and bond head, precision positioning and desired line-type gold wires can be realized, and an ultrasonic wave bonded method is used.
工作原理是通过X-Y工作台和焊头的三维运动控制，定位并拉出设定的金丝线型，采用超声波热压球焊方法焊接芯片管脚。
By controling three-dimensional motion of the X-Y table and bond head, precision positioning and desired line-type gold wires can be realized, and an ultrasonic wave bonded method is used.
工作原理是通过X-Y工作台和焊头的三维运动控制，定位并拉出设定的金丝线型，采用超声波热压球焊方法焊接芯片管脚。
应用推荐