The calculating results showed that the optimized geometry of soldering fillet is a concave shape in which the extruding length of the soldering fillet is a little more than the gap height.
计算结果表明，钎缝圆角的最佳几何形状为钎缝伸出长度略大于钎缝高度的凹型。
The important factors influencing the gaps closing include the gap height, the spatial wavelength, the specific surface energy of adhesion, the material deformability and the silicon wafer thickness.
硅片的表面起伏幅度、起伏的空间波长、表面张力、材料弹性和硅片厚度都是影响接触表面缝隙封闭的重要因素。
The important factors influencing the gaps closing include the gap height, the spatial wavelength, the specific surface energy of adhesion, the material deformability and the silicon wafer thickness.
硅片的表面起伏幅度、起伏的空间波长、表面张力、材料弹性和硅片厚度都是影响接触表面缝隙封闭的重要因素。
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