...ted），1.75±0.06，气隙强度（bgpeak)，abo（internal dia），￠102+0.1/0，厚度（thickness），11-0.2，气隙高度（gap height），9±0.1，内顶倒角（inner top gap chamfer），1x45°，内底倒角（inner bott 电子 ..
基于28个网页-相关网页
The calculating results showed that the optimized geometry of soldering fillet is a concave shape in which the extruding length of the soldering fillet is a little more than the gap height.
计算结果表明，钎缝圆角的最佳几何形状为钎缝伸出长度略大于钎缝高度的凹型。
When the relative gap height (the ratio of flap height to gap width) is in the range of 0 8-2 0, the mean pressure will reduced 30% if the flap height is smaller than the thickness of boundary layer.
底部相对间隙在0 8～ 2 0之间时，扰流片高度小于边界层厚度时的壁面平均压力比扰流片高度大于边界层厚度时小30 %左右。
The important factors influencing the gaps closing include the gap height, the spatial wavelength, the specific surface energy of adhesion, the material deformability and the silicon wafer thickness.
硅片的表面起伏幅度、起伏的空间波长、表面张力、材料弹性和硅片厚度都是影响接触表面缝隙封闭的重要因素。
应用推荐