To meet the needs of the electronic package materials, the thermal properties of the composites were analyzed.
适应电子封装选材的应用背景，对复合材料进行了热学性能分析。
With increase in electronic package density, the reliability of a board-level package under drop impact load becomes a key issue.
随着微电子封装密度的提高，板级封装在跌落冲击载荷下的可靠性成为人们关注的焦点。
Therefore, research on temperature distribution and thermal stress of micro-electronic package is very important, which has both theoretical and practical significance.
因此，对微电子封装器件的温度分布以及热应力进行研究就显得十分重要，具有重要的理论和实际意义。
On the basis of the research and development of general electronic package MC3, "SCR Quasi-witch Model" and "power Switch Model" are discussed. The simulation of electronic power circuit is performed.
在对电子线路通用分析软件MC 3开发的基础上，讨论了SCR准开关模型和功率开关模型，完成了电力电子线路的仿真。
The stimulus package provided money to convert the inefficient, paper-driven medical system to electronic records that can be easily viewed and transmitted.
这个刺激计划提供了资金，将低效的纸质化医疗系统转换成便于查看和传输的电子记录。
In short, a data-entry package negates most of the benefits of a B2B electronic relationship: it may affect prices, it may slow things down, and it may cause more errors.
简而言之，数据输入系统打消了B2B电子化联系所带来的大多数好处：它影响了价格、降低了速度、还可能带来更多错误。
Mainly applicable to the production of light-emitting diode, digital tube and soft package and other electronic related industries.
主要适用于生产发光二极管、数码管和软封装等电子相关配套行业。
Strictly speaking, the term refers to the package of electronic hardware inside a steel housing, but it is also used to refer to the complete assembly including housing.
严格的说，这一术语指仪器外壳内的电子线路包装部分，也可以指包括仪器外壳的完整装配。
In this study, the computational fluid dynamics approach is employed to analyze the heat transfer for ball grid array package that is popular in modern electronic industry.
本研究以计算流体力学的方法，对电子构装产品的明日之星- - -球栅阵列封装方式，来进行详细的热传分析。
The discount retail giant said it would offer a package deal with hardware, software and installation for electronic medical records and e-prescribing.
该零售商巨头表示，它将提供一个组合，该组合可处理硬件、软件和安装电子病案和电子处方。
Secondly, the geometric structures, stability and electronic properties of carbon nanoscrolls are calculated by using the first principles density functional calculation package CASTEP.
其次，采用第一性原理密度泛函软件包CASTEP计了算碳纳米卷的几何结构、稳定性以及电子属性。
This kind of bag applies to package electronic products with moisture-proof requirement: such as PC boards, IC integrated circuit, CD driver, hard disk and electron component parts... etc.
适用于有防潮要求的电子产品包装：各类PC板、IC集成电路、光驱、硬盘、电子元器件等。
It is widely used in carton and package of electronic, electric, industrial, and textile products. It can also add large calcium carbonate in to reduce manufacturing cost.
广泛用于纸箱、电子、电器、工业品、纺织品包装等，还可以加入重质碳酸钙降低生产成本。
The material is hopefully used as novel printed circuit board and package material of electronic components.
这样的材料在电子封装材料和印刷线路板中具有很大的应用前景。
IC package is the smallest unit in electronic systems, compact thermal models of IC packages influence the speed and accuracy of thermal analysis directly.
电子封装作为电子系统的最小组成部分，其简化模型的优劣直接影响电子系统热分析的速度和准确性。本文主要讨论单芯片封装稳态简化热模型的建立。
The Twin Active Subs reflect the synergistic advantage of integrating electronic and acoustic elements into one package.
替补的双主动反映融入一个封装电子和声学因素的协同优势。
We can conclude from experiments and numerical comparisons that this software package can provide timesaving and accurate thermal analysis for electronic equipment.
经过实验研究及数值分析对比可知：该软件可以对计算机机箱类的电子设备进行相对精确同时又比较省时的热特性分析。
We can conclude from experiments and numerical comparisons that this software package can provide timesaving and accurate thermal analysis for electronic equipment.
经过实验研究及数值分析对比可知：该软件可以对计算机机箱类的电子设备进行相对精确同时又比较省时的热特性分析。
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