Process specifications were discussed. The affecting factors on electroless Cu plating were briefly introduced.
讨论了常温化学镀铜与着色处理的工艺规范，简单介绍了化学镀铜的影响因素。
Factors affecting stability and deposition rate of electroless Cu are investigated and proper formulation and process for electroless Cu bath determined.
研究了影响化学镀铜镀速和镀液稳定性的诸因素，并根据实验确定了适宜的化学镀铜液配方及其工艺。
Satisfactory colored-films on iron craftworks were obtained by coloring process of electroless Cu plating at room temperature and chemical coloring in turn.
通过对铜原子结构的分析，提出了得到良好结合力的化学镀铜层的可能性，进而给出了使用“考本”液在钢铁上直接化学镀铜的工艺。
In this paper, electroless technology had been used to coating Cu, Ni-B on the surface of plastic matrix first, and then to dissolve matrix plastics in solvent to get Ni-B foil.
本课题利用化学镀技术在塑料基体上镀铜、镀镍硼，然后将基体塑料溶解得到镍硼箔膜。
The reaction process of electroless copper plating can be controlled by adjusting the OH-additional amounts, thus to control the morphology of Cu coatings.
通过控制镀液中OH-的补加量，能够准确控制化学镀铜反应进程及表面镀层包覆程度；
Method and baths for electroless depositing Cu on a semiconductor chip using four preferred Cu electroless baths.
方法和化学沉积浴场，半导体芯片上使用四个优先铜铜电解池。
Method and baths for electroless depositing Cu on a semiconductor chip using four preferred Cu electroless baths.
方法和化学沉积浴场，半导体芯片上使用四个优先铜铜电解池。
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