Aiming at the technology demand of advanced copper interconnection, the effect of pulse current density on cu layer properties such as resistance, crystal size and surface roughness were investigated.
针对先进纳米铜互连技术的要求，研究了脉冲电流密度对铜互连线电阻率、晶粒尺寸和表面粗糙度等性能的影响。
Effects of processing parameters on eddy current in Cu-Al-Cu cladding plate have been simulated by ANSYS software.
模拟计算了铜-铝-铜复合板参数对内部涡流电流的影响。
Recent Developments in Cu Foil as a Current Collector of Li-ion Battery.
锂离子电池铜箔负极集流器的最新开发。
The progress of hard anodizing investigation employing A. C. superimposed on D. C. , pulse current and alternating cu…
着重评述了交直流叠加，脉冲电流和交流电源在硬质阳极氧化研究中的进展情况。
In the paper, the cathode spot movements and chopping current of pure graphite and copper-impregnated metallized graphite (Cu-C) in vacuum were investigated.
研究了纯石墨和铜-石墨材料的阴极斑点的特性及真空电弧截流现象。
In the paper, the cathode spot movements and chopping current of pure graphite and copper-impregnated metallized graphite (Cu-C) in vacuum were investigated.
研究了纯石墨和铜-石墨材料的阴极斑点的特性及真空电弧截流现象。
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