Aiming at the technology demand of advanced copper interconnection, the effect of pulse current density on cu layer properties such as resistance, crystal size and surface roughness were investigated.

针对先进纳米铜互连技术的要求，研究了脉冲电流密度对铜互连线电阻率、晶粒尺寸和表面粗糙度等性能的影响。

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Effects of processing parameters on eddy current in Cu-Al-Cu cladding plate have been simulated by ANSYS software.

模拟计算了铜-铝-铜复合板参数对内部涡流电流的影响。

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Recent Developments in Cu Foil as a Current Collector of Li-ion Battery.

锂离子电池铜箔负极集流器的最新开发。

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