In this paper, the forming process of copper wire ball in copper ball bonding has been studied by numerical simulation.
本文采用数值模拟的方法研究了铜丝球键合技术中的形球过程。
From the present study, it is found that single crystal copper wires can be bonded on the gold pad and the aluminum pad by thermosonic ball bonding and wedge bonding without gas protection.
从目前的研究中，它被发现，单晶铜线材可以键合金垫和铝焊盘上由无气体保护的热超声球焊和楔焊。
Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method.
丝焊方法，半导体器件，丝焊的毛细管及球块形成方法。
Introduces the principle of the tin-ball laser bonding on hard disk sliders and its merit.
介绍硬盘磁头激光锡球焊接的原理和优点；
The network bonding point is firm, but is not slip. The ball shaped plastic avoids the network contacting floor directly, and reduces abrasion, further prolonging the net service life.
网络结点坚固，不滑移，球状塑料避免了网络直接触及地面，减少磨损，延长网络使用寿命。
The network bonding point is firm, but is not slip. The ball shaped plastic avoids the network contacting floor directly, and reduces abrasion, further prolonging the net service life.
网络结点坚固，不滑移，球状塑料避免了网络直接触及地面，减少磨损，延长网络使用寿命。
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