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Development of these work is of benefit to raising quality of gold wire ball bonding.
这些工作的开展有利于提高金丝球焊的焊接质量。
In this paper, the forming process of copper wire ball in copper ball bonding has been studied by numerical simulation.
本文采用数值模拟的方法研究了铜丝球键合技术中的形球过程。
From the present study, it is found that single crystal copper wires can be bonded on the gold pad and the aluminum pad by thermosonic ball bonding and wedge bonding without gas protection.
从目前的研究中，它被发现，单晶铜线材可以键合金垫和铝焊盘上由无气体保护的热超声球焊和楔焊。
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