• In this photo, a worker heats a computer board on a steel surface to remove the computer chips soldered into it.

    图中的这位工人在一块钢板表面加热一块电脑电路板以取下焊接在上面的芯片原件。

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  • I resolved to silence it, if possible; I endeavoured to unhasp the casement, but the hook was soldered into the staple.

    我决定把这声音止住,如果可能的话。我试着去打开那窗子,但窗钩给焊在钩环里了。

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  • Found outside Baghdad, Iraq in 1936, the Baghdad Battery is a small clay jar containing an iron rod suspended in a copper cylinder which is soldered shut and sealed with asphalt.

    1936年在伊拉克巴格达郊外发现的巴格达电池由一根小铁棍悬空在一个由沥青密封的铜制容器中,该容器置于一个陶土罐里。

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  • A broken friendship may be soldered but will never be sound.

    破裂的友谊可以重归于好,但绝不会亲密无间。

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  • The third step, the cable soldered to the solder hole.

    第三步,把电缆焊接到焊接孔上。

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  • Measurement point is soldered by high temperature tin.

    量测点以高温锡丝焊接。

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  • The LED should be soldered within 6 hours after opening the package.

    打开包装后请在6小时内作焊接。

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  • The lead, after being skinned, will be soldered on the cores directly.

    引线自动剥皮后直接焊接在电容芯子上。

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  • The parts should be soldered in the same order as shown in the listing.

    元件应该按照下表的顺序进行焊接。

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  • Yes, the processors are soldered to the motherboard (bottom shown here).

    是的,该处理器是焊接到主板(这里显示的底部)。

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  • The LED should be soldered within 48 hours (2 days) after opening the package.

    打开包装后请在48小时内作焊接。

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  • I endeavoured to uncap the casement, but the hook was soldered into the staple.

    我试着去打开那窗子,但窗钩给焊在钩环里了。

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  • If the soldered joints are exposed, check for visible signs of crack formation.

    如果露出了焊接点,检查是否形成了裂纹。

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  • The international standard specifies a soldered pin connector for circuit boards.

    国际标准为电路板选定了焊接针连接器。

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  • The capsule element system consists of two capsule element halves soldered together.

    膜盒系统包括两个焊接在一起的膜盒半元件。

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  • The strength of soldered joint is less than a joint which is brazed, riveted or welded.

    锡焊点的连接力要小于钎焊、铆接或焊接的连接点。

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  • Careful inspection showed that the statue's head had been cast separately and soldered in place.

    仔细检查发现雕像的头部是铸好后再焊接上去的。

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  • Replacement of diodes that are soldered to the heat sink is permitted provided that a controlled heat source is used.

    如果使用了可以控制的热源,可以更换焊到散热片散热板上的二极管。

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  • The extending portion is electrically connected by being reflow soldered to a land at a reverse surface of the substrate.

    所述延伸部通过回流焊接与在基板背面的接合部电连接。

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  • This study benchmarked the strength of solder joints formed through the Through - Hole Reflow process against the traditional wave soldered joint.

    以波峰焊工艺焊点强度为标准,研究在不同钎料量下通孔再流焊焊点的强度。

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  • Franklin's expedition carried nearly 8 000 lead-soldered tins containing meat, soup, vegetables and pemmican - a pressed cake of shredded dry meat.

    富兰克林探险队则带有近八千个装有肉、汤、蔬菜,以及压缩肉糜饼(一种用干肉捣碎压制而成的饼)的含铅焊锡封口的罐头。

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  • ANSYS software was employed to establish three-dimensional strip model of CCGA624 device and optimized simulation of soldered column dimension was also studied.

    借助ANSYS有限元软件建立CCGA624器件的三维条状模型,基于应变对焊柱可靠性进行优化模拟分析。

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  • To solve this pivotal problem, the design of special device to finish machining the sealing surface of soldered pipe board and bundles in locale becomes urgent.

    针对这一问题,设计了一种能在现场对管束焊装后的管板密封面进行精加工处理的专用装置。

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  • Application of soldered finned tube to convection section of high hydrogenation heater in refinery is proved to be safe and reliable through industrial practice.

    工艺应用实践表明,钎焊翅片管应用于炼油厂高压加氢加热炉对流段是安全可靠的。

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  • Residue stress in the ceramic chip of the composite tappet rod may be reduced by intermediate layer of soldered connection and by decreasing thickness of ceramic chip.

    钎焊过渡层和减薄陶瓷块厚度可降低钎焊复合挺柱中陶瓷块的残余应力。

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  • The maximum stress of PBGA121 soldered joints increases when chip size increases, while the maximum stress of PBGA81 soldered joints decreases first and then increases.

    芯片尺寸改变时,PB -GA121焊点的最大应力值随芯片尺寸的增大而增大,但PBGA81的最大应力值随芯片尺寸增大先减小后增大。

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  • The invention relates to a plug device comprising a circuit board and a plug connector, wherein the plug connector is soldered onto the circuit board in a flush manner.

    本发明涉及一种插塞装置,所述插塞装置包括电路板和插塞连接器,其中所述插塞连接器平面地焊接在所述电路板上。

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  • If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface.

    如果这个块焊接至布线基板上的焊盘,焊料将沾湿于柱状块上表面整个区域,和侧表面的部分区域。

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  • If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface.

    如果这个块焊接至布线基板上的焊盘,焊料将沾湿于柱状块上表面整个区域,和侧表面的部分区域。

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