This is a semiconductor integrated circuit.
这是一个半导体集成电路。
The present invention provides a semiconductor integrated circuit having internal voltage generating circuit.
本发明提供了一种具有内部电压发生电路的半导体集成电路。
The invention relates to a defect analysis method for semiconductor integrated circuit devices and a defect analysis system.
本申请涉及用于半导体集成电路设备的缺陷分析方法和缺陷分析系统。
A semiconductor integrated circuit comprises an electrostatic actuator, an estimation circuit, a storage circuit and a bias circuit.
半导体集成电路具有静电型致动器、检测电路、存储电路及偏置电路。
Write prohibition circuit, semiconductor integrated circuit containing the same, ink cartridge having this semiconductor integrated circuit, and ink jet recorder.
写入禁止电路，使用了该电路的半导体集成电路，具有该半导体集成电路的墨水匣以及喷墨记录装置。
IGCT is a kind of high power semiconductor based on GTO structure, which achieves hard turn-off by the integrated gate circuit.
IGCT是一种基于GTO结构并利用集成门极电路进行硬驱动控制的大功率半导体开关器件。
This kind of tester has a enormous practical prospect in many fields, such as electronic glass, semiconductor, integrated circuit, thin films and technology of nanometer.
这种测试仪在电子玻璃、半导体、集成电路、薄膜和纳米技术等领域都具有很大的应用前景。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
This paper introduces a simple and easy temperature measuring and controlling system made up of a new -type temperature-measuring integrated circuit DS1820 and semiconductor refrigerator.
介绍了一种使用新型测温集成电路ds1820和半导体致冷器件组成的简单精巧的温度测控系统。
Integrated circuit packaging is a backend process of semiconductor industry. Due to the modeling diversification of assembly, process accuracy is required to higher quality.
积体电路封装为整个半导体产业后半段制程，然而封装的型式多样化，相对的制程精准度要求也越来越高。
The silicon chip is a main component of the semiconductor apparatus; there is extensive application in printing the integrated circuit and miniature integrated instrument.
硅片是半导体器材的主要元件，在印刷集成电路及微型集成仪表中有着广泛应用。
This article introduces the application of specialty gases in electronics industries, such as integrated circuit, solar cell, compound semiconductor, TFT-LCD and optical fiber perform.
论述了特种气体在集成电路、太阳能电池、化合物半导体、液晶显示器和光纤预制棒等电子行业中的应用，并就其使用安全提出了建议。
The present invention brings forward a method for determining leakage currents in integrated circuit and metal oxide semiconductor element.
本发明提出一种集成电路及金属氧化物半导体元件中判断漏电流的方法。
With the rapid development of semiconductor technology, integrated circuit has stepped into a new era of SOC.
随着集成电路工艺与技术的飞速发展，集成电路已经进入系统级芯片阶段。
These measurements include temperature and ir drop at locations on the semiconductor substrate, along with the frequency response of integrated circuit.
这些测量包括半导体衬底上的各位置处的温度和IR降、以及集成电路的频率响应。
Therefore, a semiconductor device including a thin film integrated circuit can be manufactured easily.
因此，可以容易地制造包含薄膜集成电路的半导体器件。
The invention discloses the method of reclaiming and utilizing the silicon single crystal waste of semiconductor device and integrated circuit.
本发明公开了一种半导体器件与集成电路硅单晶废弃片的回收利用方法。
Computer chip: or chip; integrated circuit or small wafer of semiconductor material embedded with integrated circuitry, comprises the processing and memory units of the modern digital computer.
芯片：集成电路或嵌入集成电路的小而薄的半导体，包含现代数字计算机的处理和记忆装置。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅；
With the development of semiconductor process technology, nowadays a system on a PCB (Printed Circuit Board) which is composed of several ICs can be integrated into a chip.
随着集成电路制造工艺的飞速发展，人们已经可以将原先用各种电路搭建的板极系统集成在一块芯片上。
With the development of semiconductor process technology a system on a PCB (Printed Circuit Board) which is composed of several ICs can be integrated into a chip.
随着集成电路工艺的飞速发展，人们已经可以将原先的板级系统集成在一块芯片上，系统芯片逐渐成为集成电路设计的主流发展趋势。
Measurement circuit components are included in an integrated circuit fabricated on a semiconductor substrate.
本发明涉及一种用于调整供应给电路的电压的集成电路、电子系统和方法。
A complementary metal oxide semiconductor (CMOS) readout integrated circuit (ROIC) for the sensitive material of vanadium dioxide (VO_2) was introduced.
介绍了一种针对二氧化钒敏感材料的CMOS读出电路(RO IC)。
A complementary metal oxide semiconductor (CMOS) readout integrated circuit (ROIC) for the sensitive material of vanadium dioxide (VO_2) was introduced.
介绍了一种针对二氧化钒敏感材料的CMOS读出电路(RO IC)。
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