He has taken out a patent on his innovative packaging technology.
他甚至为了自己独到的包装技术申请了专利。
This paper proposes MOEMS devices, make process and packaging technology.
文章介绍了MOEMS器件，主要就其制作工艺和封装技术做了讨论。
In this paper, new progress of electronic packaging technology is presented.
本文综述了电子封装技术的最新进展。
As such, from an architectural perspective, OSGi is just a specific packaging technology.
这样，从一个架构的角度来，OSGi只是一个特殊的封装打包技术。
Combined modified-atmosphere packaging technology is the key of miniature modified-atmosphere chain.
联合气调包装技术是微型气调链的核心技术。
Surface mount BGA Packaging Technology for high-speed Optoelectronic modules is described in this paper.
本文介绍了用于高速光电组件的表面安装型焊球阵列（BGA）封装技术。
In packaging technology, the study primarily for on-line packed in the design and application programming.
在包装的技术方面，主要对于在线包装在节目制作的设计和应用进行研究。
The mechanism of food preservation and the characteristics of intelligent packaging technology were analyzed.
智能包装可以更好的对食品起到保鲜作用，已成为包装界关注的焦点。
The factory is China Packaging Technology Association unit , provincial contract and keeping promises enterprises.
本厂是中国包装技术协会会员单位，省级重合同守信用企业。
The vacuum obtains and maintenance is still still the main problem in the field of MEMS vacuum packaging technology.
真空的获得和维持是目前MEMS真空封装技术中存在的主要难题之一。
The high density packaging technology for LSI becomes more and more important as LSI and VLSI are developing rapidly.
随着LSI和VLSI的飞速发展，LS I高密度封装技术变得越来越重要。
The coil packaging technology of China has fallen behind the developed country. Coil packaging has always been ignored.
我国在钢卷包装技术上与世界工业发达国家相比落后很多，经常受到忽视。
Transfer molding is widely applied in semiconductor packaging technology by itssuperior in mass production and reliability.
树脂传递模封装是广泛使用的可靠性量产性均好的半导体封装方法。
"2006 by the China Packaging Technology Association awarded the" China Excellent Packaging Enterprise "and many other titles."
2006年被中国包装技术协会授予“中国优秀包装企业”等多项称号。
The present paper is to cover the actuality of electronic packaging technology in the world and face the lead-free problem in homeland.
本文综述了电子封装技术的现状以及我国如何面对无铅化的问题。
The development, characteristics, advantages, heat emis - sion and applications of the stacked 3d packaging technology were introduced.
对其叠层3D封装的发展趋势、技术特点、技术优势、散热问题以及应用前景等几个方面进行了探讨。
Thus, by optimized the process and packaging technology can make thin film polarizing beam splitter to reach the application requirements.
由此可见，通过优化镀制工艺和封装工艺可以使薄膜偏振分束镜的指标达到使用要求。
The paper introduces the packaging technology and materials for the anti-high load circuit. It explores the packaging craftsmanship in details.
本文介绍了抗高过载电路的封装技术与封装材料，对抗高过载电路的封装工艺作了详尽的探讨。
The COF/MEMS packaging technology is well-suited for many microsystem packaging applications such as micro-optics and radio frequency(RF) devices.
COF/MEMS封装技术非常适合于诸如微光学及无线射频器件等很多微系统封装的应用。
IC manufacturing faced the challenges of physical limits, 3d packaging technology has increasingly become the focus of the microelectronics industry.
在IC制造技术受到物理极限挑战的今天，3d封装技术越来越成为了微电子行业关注的热点。
The microelectronic packaging technology is an important technology that affects performance, size, price and reliability of final electronic products.
微电子封装技术是一项重要的技术，这项技术直接影响最终电子产品的性能、外形尺寸、价格及可靠性能。
It is discusses the effect way to improve high power LED packaging technology, from dice selection, improve thermal management and how to select silicon Gel.
从芯片选择、改善热处理工艺以及如何选择硅胶等几个方面入手，本文讨论了如何有效地提高功率型LED封装工艺。
It also introduced the working principles and construction features as well as practical effects of the controllable crypto anti-forgery packaging technology.
介绍一种可控密码防伪包装技术的结构特点、作用原理及实际防伪效果。
It is noted that microelectronic packaging technology becomes one of the most important and challenging technologies in radar and all other electronic products.
令人瞩目的是微电子组装技术正在成为现代雷达及其他电子设备中最重要的关键技术之一。
We continue to train the employees with the newest printing and packaging technology and the newest design ideas to adapt the ever-changing market requirements.
企业不断培养员工学习最新印刷包装工艺和最新设计理念，以适应变化的市场要求。
Starting from an introduction of modified atmosphere packaging(MAP)technology this paper analyzes where the key of vegetable and fruit packaging technology lies.
从自然气调包装（MAP）技术原理的介绍出发，分析了果蔬食品包装的技术关键。
The Krones Group, with its headquarters in Neutraubling, Germany, develops and manufactures machines and complete lines for all areas of filling and packaging technology.
克朗斯集团公司总部设在德国的新特劳普林，开发、制造用于灌包装技术各领域的机器及全套生产线。
The acquisition includes the purchase of all BOSSAR assets and subsidiaries, its full line of proprietary packaging technology and its manufacturing site in Barcelona, Spain.
此次收购包括BOSSAR所有资产和子公司，其全系列的专利包装技术及其在西班牙巴塞罗那生产基地。
The acquisition includes the purchase of all BOSSAR assets and subsidiaries, its full line of proprietary packaging technology and its manufacturing site in Barcelona, Spain.
此次收购包括BOSSAR所有资产和子公司，其全系列的专利包装技术及其在西班牙巴塞罗那生产基地。
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