Combined modified-atmosphere packaging technology is the key of miniature modified-atmosphere chain.
联合气调包装技术是微型气调链的核心技术。
Surface mount BGA Packaging Technology for high-speed Optoelectronic modules is described in this paper.
本文介绍了用于高速光电组件的表面安装型焊球阵列（BGA）封装技术。
The mechanism of food preservation and the characteristics of intelligent packaging technology were analyzed.
智能包装可以更好的对食品起到保鲜作用，已成为包装界关注的焦点。
The factory is China Packaging Technology Association unit , provincial contract and keeping promises enterprises.
本厂是中国包装技术协会会员单位，省级重合同守信用企业。
The high density packaging technology for LSI becomes more and more important as LSI and VLSI are developing rapidly.
随着LSI和VLSI的飞速发展，LS I高密度封装技术变得越来越重要。
Transfer molding is widely applied in semiconductor packaging technology by itssuperior in mass production and reliability.
树脂传递模封装是广泛使用的可靠性量产性均好的半导体封装方法。
"2006 by the China Packaging Technology Association awarded the" China Excellent Packaging Enterprise "and many other titles."
2006年被中国包装技术协会授予“中国优秀包装企业”等多项称号。
The development, characteristics, advantages, heat emis - sion and applications of the stacked 3d packaging technology were introduced.
对其叠层3D封装的发展趋势、技术特点、技术优势、散热问题以及应用前景等几个方面进行了探讨。
The paper introduces the packaging technology and materials for the anti-high load circuit. It explores the packaging craftsmanship in details.
本文介绍了抗高过载电路的封装技术与封装材料，对抗高过载电路的封装工艺作了详尽的探讨。
The COF/MEMS packaging technology is well-suited for many microsystem packaging applications such as micro-optics and radio frequency(RF) devices.
COF/MEMS封装技术非常适合于诸如微光学及无线射频器件等很多微系统封装的应用。
The microelectronic packaging technology is an important technology that affects performance, size, price and reliability of final electronic products.
微电子封装技术是一项重要的技术，这项技术直接影响最终电子产品的性能、外形尺寸、价格及可靠性能。
It also introduced the working principles and construction features as well as practical effects of the controllable crypto anti-forgery packaging technology.
介绍一种可控密码防伪包装技术的结构特点、作用原理及实际防伪效果。
It is noted that microelectronic packaging technology becomes one of the most important and challenging technologies in radar and all other electronic products.
令人瞩目的是微电子组装技术正在成为现代雷达及其他电子设备中最重要的关键技术之一。
We continue to train the employees with the newest printing and packaging technology and the newest design ideas to adapt the ever-changing market requirements.
企业不断培养员工学习最新印刷包装工艺和最新设计理念，以适应变化的市场要求。
Starting from an introduction of modified atmosphere packaging(MAP)technology this paper analyzes where the key of vegetable and fruit packaging technology lies.
从自然气调包装（MAP）技术原理的介绍出发，分析了果蔬食品包装的技术关键。
The Krones Group, with its headquarters in Neutraubling, Germany, develops and manufactures machines and complete lines for all areas of filling and packaging technology.
克朗斯集团公司总部设在德国的新特劳普林，开发、制造用于灌包装技术各领域的机器及全套生产线。
The acquisition includes the purchase of all BOSSAR assets and subsidiaries, its full line of proprietary packaging technology and its manufacturing site in Barcelona, Spain.
此次收购包括BOSSAR所有资产和子公司，其全系列的专利包装技术及其在西班牙巴塞罗那生产基地。
To determine the overall program, packaging technology, the movement of materials using a combination of vertical and horizontal square Type, thereby reducing the size of the machine.
确定了总体方案、包装工艺，物料的运动方式采用垂直与水平相结合的方式，从而缩短了机器的尺寸。
Aseptic packaging technology refers to a method of filling and sealing in a sterile environment after products to be packaged and packaging containers, materials or AIDS are sterilized.
无菌包装技术是指产品、包装容器、材料或包装辅助器材经灭菌后，在无菌的环境中进行充填和封口的一种包装方法。
In this paper, food packaging technology in common use and the technical equipments in food industry are presented. The author summarizes the characteristics of the packaging technology.
介绍了食品工业常用的包装技术及其相关的技术设备，总结了包装技术的特点。
In this paper, food packaging technology in common use and their technical equipments in food industry are presented. The author summarizes the characteristics of the packaging technology.
介绍了食品工业常用的包装技术及其相关的技术设备，总结了包装技术的特点。
COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
The Krones Group, headquartered in Neutraubling, Germany, plans, develops and manufactures machines and complete lines for the fields of process, filling and packaging technology and intralogistics.
总部位于德国新特劳普林的克朗斯是一家能为流程、灌装、包装技术以及工厂内部物流等领域设计、研发并生产机器与全套设备的大型集团企业。
Global semiconductor packaging materials Outlook is a comprehensive market research study that examines semiconductor packaging technology trends and their impact on the packaging materials markets.
全球半导体封装材料市场展望报告全面调研了半导体封装工艺趋势记忆其对封装材料市场的影响。
But similar technology could be used to do things silicon can't do, he says, such as make smart bandages that can sense infections or freshness-sensing food packaging.
不过，他表示，可以利用类似的技术实现硅片所无法做到的，比如，制造能检测传染病的智能型绷带，或者能感应食品是否新鲜的包装。
Jobs sees product packaging as a helpful way to introduce new, unfamiliar technology to consumers.
乔布斯认识到产品的包装是一种向消费者推介全新、陌生科技产品的有效方式。
Company personnel have many years specialized in thermal transfer, bronzing, packaging machinery, technology and management experience.
公司人员具有多年专业从事热转印，烫金，包装机械，技术和管理经验。
Company personnel have many years specialized in thermal transfer, bronzing, packaging machinery, technology and management experience.
公司人员具有多年专业从事热转印，烫金，包装机械，技术和管理经验。
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