High Density Electronic Packaging?
高密度电子封装 HDEP?。
In this paper, new progress of electronic packaging technology is presented.
本文综述了电子封装技术的最新进展。
The prospects for the further development of electronic packaging materials were given.
并展望了电子封装材料的发展前景。
Flip chip technology has become one of the major joining technologies in electronic packaging.
摘要覆晶技术已成为电子构装中之主要接合技术之一。
Flip chip technology has become one of the major joining technologies in electronic packaging.
覆晶技术已成为电子构装中之主要接合技术之一。
"Smart" packaging materials such as cereal boxes that include electronic displays are another possibility.
另一种可能的用途是“智能”包装材料，比如带电子显示屏的装谷物的箱子。
Full-automatic packaging machine, packaging machine, electronic scale electronic scale electronic scale tea packing machine.
电子称包装机，电子秤全自动包装机，电子称茶叶包装机。
Full-automatic packaging machine, packaging machine, electronic scale electronic scale electronic scale tea packing machine.
电子称包装机，电子秤全自动包装机，电子称茶叶包装机。
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