In this paper, new progress of electronic packaging technology is presented.
本文综述了电子封装技术的最新进展。
Flip chip technology has become one of the major joining technologies in electronic packaging.
摘要覆晶技术已成为电子构装中之主要接合技术之一。
Flip chip technology has become one of the major joining technologies in electronic packaging.
覆晶技术已成为电子构装中之主要接合技术之一。
With technology of low temperature co-fired ceramic going mature gradually, it evolves to investigative hot spot in the field of electronic packaging.
低温共烧陶瓷(L TCC)技术目前正逐渐走向成熟，并成为电子封装领域研究的热点。
He has extensive experience in the fields of semiconductor and electronic packaging, electronic manufacturing, surface finishes and coatings, failure mode analysis and reliability assessment. Dr.
在半导体电子封装，电子制造，表面镀层及涂覆，失效模式分析和可靠性评估方面具有丰富经验。
The resin had better process properties, higher mechanical properties, and could be used as a RTM matrix resin for high performance composites or as a high performance electronic packaging resin.
实验结果表明，这种树脂具有良好的工艺性能和较高的力学性能，可作为树脂传递模塑成型rtm的高性能复合材料基体树脂或高性能封装用树脂。
Electronic Packaging Materials;
电子封装材料；
High Density Electronic Packaging?
高密度电子封装 HDEP?。
The Preparation and Property Research of Epoxy Resin Based Electric Electronic Packaging Material;
研究了玻璃粉／环氧树脂封接复合材料的制备与性能。
The company was established in 2005, majoring in electronic, packaging, and other industrial products.
公司始创于2005年，主营电子、包装以及其它工业类产品。
Solders are the main join materials in the electronic - packaging and now lead-free solders are used in the electrical products on a large scale.
在电子封装中焊料是主要的连接材料，现在无铅焊料已经普及并大规模应用在实际电子产品中。
Solders are the main join materials in the electronic - packaging and now lead-free solders are used in the electrical products on a large scale.
在电子封装中焊料是主要的连接材料，现在无铅焊料已经普及并大规模应用在实际电子产品中。
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