Electronic Packaging Materials;
电子封装材料；
High Density Electronic Packaging?
高密度电子封装 HDEP?。
In this paper, new progress of electronic packaging technology is presented.
本文综述了电子封装技术的最新进展。
The prospects for the further development of electronic packaging materials were given.
并展望了电子封装材料的发展前景。
Flip chip technology has become one of the major joining technologies in electronic packaging.
摘要覆晶技术已成为电子构装中之主要接合技术之一。
Flip chip technology has become one of the major joining technologies in electronic packaging.
覆晶技术已成为电子构装中之主要接合技术之一。
The Preparation and Property Research of Epoxy Resin Based Electric Electronic Packaging Material;
研究了玻璃粉／环氧树脂封接复合材料的制备与性能。
So it is necessary to research and develope the advanced microelectronic packaging to replace the conventional electronic packaging.
为此，必须研究采用先进的微电子组装技术取代落后的常规电子组装技术。
The invention relates to polyphenyl methylsiloxane modified epoxy resin and a manufacturing method of an electronic packaging material thereof.
本发明涉及聚苯基甲基乙氧基硅烷改性环氧树脂及其电子封装材料的制法。
With technology of low temperature co-fired ceramic going mature gradually, it evolves to investigative hot spot in the field of electronic packaging.
低温共烧陶瓷(L TCC)技术目前正逐渐走向成熟，并成为电子封装领域研究的热点。
ANSYS Q3D Extractor software is the premier 3-d and 2-d parasitic extraction tool for engineers designing electronic packaging and power electronic equipment.
ANSYSQ3D提取软件是首屈一指的3 -D和2 -D寄生提取工具，电子封装和电力电子设备设计的工程师。
It is noted that microelectronic packaging technology becomes one of the most important and challenging technologies in radar and all other electronic products.
令人瞩目的是微电子组装技术正在成为现代雷达及其他电子设备中最重要的关键技术之一。
He has extensive experience in the fields of semiconductor and electronic packaging, electronic manufacturing, surface finishes and coatings, failure mode analysis and reliability assessment. Dr.
在半导体电子封装，电子制造，表面镀层及涂覆，失效模式分析和可靠性评估方面具有丰富经验。
The resin had better process properties, higher mechanical properties, and could be used as a RTM matrix resin for high performance composites or as a high performance electronic packaging resin.
实验结果表明，这种树脂具有良好的工艺性能和较高的力学性能，可作为树脂传递模塑成型rtm的高性能复合材料基体树脂或高性能封装用树脂。
Such batteries aren't ideal for every application, but they could be extremely useful in future incarnations of smart packaging, RFID sensing, and electronic paper products.
这种电池是并不是所有设备的最理想配件，但它们可能在未来大有用处，如智能化包装，RFID应用以及电子纸产品。
Packaging trends of portable electronic products are introduced in the article.
本文主要描述了便携式电子产品的封装趋势。
They are employed by companies that manufacture products such as clothing, footwear, furniture and electrical and electronic products and by printing and packaging companies.
他们受雇于生产以下产品的公司，如服装，鞋类，家具和电器及电子产品，印刷包装企业。
Product packaging equipment, electronic weighing equipment, automatic bag-storage cupboard.
商品包装设备、电子称重设备、自动存包柜；
Electronic industry, prevent dust pollution and other kinds of packaging materials, prevent the bags with clothing.
电子工业，防止灰尘污染等各类包装材料，防止与服装粘结的各类包装袋。
Electronic products in the series decided to use the packaging, such as lines and color to express the flow of flu and flu jumping.
对该系列电子产品的包装决定运用线条及色块等方式来表现流动感与跳跃感。
Modern packaging or printing enterprises need to dispose rapidly increasing electronic documents, how to store and utilize this digital asset effectively becomes a practical problem.
现代包装印刷企业需要处理日益增多的电子文档，如何有效地存储和利用这些数字资产成为一个现实问题。
Xi 'an Lishan Electronics is a professional Packaging Association, and electronic components supplier.
西安骊山电子公司是一家专业的外协封装和电子元器件供应商。
China's electronic information product packaging has been made great progress, but in some respects, there are still some issues that can not be ignored.
我国电子信息产品包装已经取得了长足的进步，但在某些方面也存在着一些不容忽视的问题。
In this paper, the author introduces the packaging method of military electronic system spares for long preservation, this method has been used in our army.
本文简要介绍了电子装备备件满足长期保存要求的包装方法，该方法已在我军内推广使用。
Specializing in the production truck, the floor, axle load scales, electronic Hanging scale, conveyor, belt scales, hopper scales, packaging, scales, scales, and other platforms.
本厂专业生产汽车衡、地上衡、轴重秤、电子吊秤、皮带秤、抓斗秤、料斗秤、包装秤、平台秤等。
This product is widely adopted in such industries as cooling, electronic bulbs, printing, food packaging, medical treatment, instruments, and chemical engineering etc.
本产品广泛用于制冷、电子灯泡行业、 印刷、制冷、食品包装、医疗、仪器化工等行业。
Finally, some kinds of combined inspection technologies based on AOI in electronic assembling packaging are introduced in this article.
最后介绍了几种基于AOI的电子组装综合检测技术。
Electronic - components. parkaging of components for automatic handling. part 1 : tape packaging of components with axial leads on continous tapes.
电子元件。自动运输用零部件的包装。第1部分：连续胶带上带轴向引线的元件用胶带包装。
The digital anti-counterfeiting is the mainstream of domestic anti-counterfeiting technologies, which was widely applied in domains of product packaging and electronic commerce.
数码防伪是国内主流的防伪技术，广泛应用于产品包装、电子商务等领域。
The digital anti-counterfeiting is the mainstream of domestic anti-counterfeiting technologies, which was widely applied in domains of product packaging and electronic commerce.
数码防伪是国内主流的防伪技术，广泛应用于产品包装、电子商务等领域。
应用推荐