• Can be realized a multi-chip module, and one multi-machine.

    可实现一模多片,一人多机。

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  • The concepts of "micromachining" and Multi-Chip-Module (MCM) integrated from DC to RF components will be explained also.

    文中将涉及微加工技术以及从直流至射频的多芯片全集成新概念。

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  • Mask line Machining made of non-woven using high-quality, single and multi-chip packaging, and customers can request for sterilization.

    面膜系采用优质无纺布加工制成,有单片和多片包装,并可按客户要求作灭菌处理。

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  • NVM and analog circuits are embedded on a single chip that can incorporate multiple functions conventionally executed by a multi-chip system.

    NVM和模拟电路被嵌入在单个芯片可以掺入由一个多芯片系统通常执行多种功能上。

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  • Multi-chip packaging ( MCP ) technologies and their basi status, state-of-art of applications for mobile phone memory are reviewed in this paper.

    文章评述多芯片封装技术及目前的基本情况,这一技术在手机存储器的应用现状等。

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  • For fabrication, a thin film process of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.

    在制作上,根据性能和结构要求,采用了高密度布线、多芯片组装的薄膜工艺。

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  • Further, it USES Dual Chip Modules (DCMs) and Multi-Chip Modules (MCMs) as the basic building blocks for its mid-range and high-end servers, respectively.

    此外,它还分别使用双芯片模块(DCM)和多芯片模块(MCM)作为其中端服务器和高端服务器的基本构建块。

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  • Low Temperature Co-fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multi-chip modules (MMCM).

    低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)一种理想的组装技术。

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  • The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.

    本实用新型公开一种多芯片封装结构,至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。

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  • Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.

    阐述了MEMS的主要封装工艺和技术,包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。

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  • The essay introduces multi-chip calculator communication system based on RS-485 bus, especially MAX-487 chip and the components of the communication system and gives the flow diagram.

    介绍了基于RS-485总线的单片机多机通信系统,重点介绍了MAX-487芯片和通信系统的组成,并给出了流程图。

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  • This paper described the C4 fabrication of Multi-chip-modules and the MCM process, and also described the key point of MCM technology, the variety of MCM, the bump fabrication methods.

    本文主要论述了MCM工艺过程及多芯片组装技术中的C4技术。并对M CM种类、MCM关键工艺、M CM凸点的制作方法等做了简单介绍。

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  • The pattern metal layer is arranged on the insulation layer and filled into the diversion holes, thereby being an inner linking layer of the multi-chip packaging structure of the utility model.

    图案化金属层位于绝缘层上并填入于导通孔中,以作为本实用新型多芯片封装结构的内连线层。

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  • Multi-core processors, where a single CPU chip has several processors sharing resources, are here to stay.

    现在出现了多核处理器,它是单个CPU片拥有共享资源的多个处理器。

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  • It provides the licensing granularity needed to leverage various multi-core chip and virtualization technologies.

    它提供使用各种多核芯片和虚拟化技术所需的许可证粒度。

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  • Now, to manage CPU power dissipation, processor makers favor multi-core chip designs, and software has to be written in a multi-threaded or multi-process manner to take full advantage of the hardware.

    当前,为了管理CPU性能损耗,处理器生产厂商倾向于采用多核芯片设计,并且软件必须以多线程或者多进程的方式来编写,从而发挥硬件的最大优势。

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  • Apple may well be working on a multi-core follow-up to the chip that powers the iPad and iPhone 4, which would substantially boost performance without sacrificing much in the way of power consumption.

    苹果可能也还在开发多核心的新一代芯片用于iPad与iPhone4,它将让性能得到质的飞跃,同时不会在电力消耗上作出太大的牺牲。

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  • Objective To investigate the application of multi-tumor markers Protein Chip Diagnose System in the diagnosing of lung cancer.

    目的研究多肿瘤标志物蛋白芯片诊断系统用于肺癌的临床诊断价值。

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  • The unit which consisted of two peristaltic pumps and a multi function sampling valve was controlled by a single chip microprocessor.

    该仪器采用二泵一阀系统,由单片机控制,具有双路信号实时采集和数据处理功能。

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  • AIM To study protein chip system for multi tumor markers detection in the diagnosis of cancer.

    目的研究多肿瘤标志物蛋白芯片检测系统在肿瘤诊断中的应用价值。

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  • This paper presented a new method for multi chip module routing.

    对多芯片组件的布线方法提出了一种新的方法。

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  • Objective To investigate the application of multi-tumor markers protein chip diagnosis system in the Pancreatic cancer.

    目的探讨多肿瘤标志物蛋白芯片诊断系统对胰腺癌的诊断价值。

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  • Objective To investigate the application of multi-tumor markers protein chip diagnostic system in the diagnosis of gastric cancer.

    目的研究多肿瘤标志物蛋白芯片诊断系统用于胃癌的诊断价值。

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  • Objective: To investigate the application of Multi-tumor markers Protein Chip diagnostic System in the diagnostic of pancreatic cancer.

    目的:研究多肿瘤标志物蛋白芯片诊断系统对胰腺癌的诊断价值。

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  • Objective To evaluate the diagnostic value of multi-tumor markers protein chip detective system for malignant tumor.

    目的评价多肿瘤标志物蛋白芯片检测系统在恶性肿瘤诊断中的应用价值。

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  • By adopting PID synchronous control algorithm, single chip microcomputer and photoelectric digital measuring technology, multi motor synchronous drive microcomputer control device ws developed.

    采用PID同步控制算法、单片机控制技术和光电数字测量技术,研制了多电机同步传动微机控制装置。

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  • Objective To investigate the clinical applicability of multi-tumor markers protein chip and CLIA for diagnosis of malignancy.

    目的:探讨多肿瘤标志物蛋白芯片与化学发光检测对肿瘤诊断的临床应用价值。

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  • The multi-functional chip ADT14 is a kind of multi-point temperature monitor of outputting logic level control signal, It is also a kind of temperature sensor of outputting simulated voltage signal .

    多功能芯片ADT14既是一种输出逻辑电平控制信号的多点温度监控器,又是一种输出模拟电压信号的温度传感器,可广泛应用于各种嵌入控制系统中。

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  • The multi-functional chip ADT14 is a kind of multi-point temperature monitor of outputting logic level control signal, It is also a kind of temperature sensor of outputting simulated voltage signal .

    多功能芯片ADT14既是一种输出逻辑电平控制信号的多点温度监控器,又是一种输出模拟电压信号的温度传感器,可广泛应用于各种嵌入控制系统中。

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