Multi-chip module 多晶片模组
Multi-Chip-Module 多芯片芯片模块 ; 多芯片模块
Memory Multi-Chip Package 多芯片内存模块
MCM-Multi Chip Module 多晶片模组
Multi-Chip Packaging 多芯片封装
Multi-chip saw 多片锯
multi chip model 多芯片模块 ; 多芯片组件
Multi-Chip Packages 多芯片模块制造技术
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Mask line Machining made of non-woven using high-quality, single and multi-chip packaging, and customers can request for sterilization.
面膜系采用优质无纺布加工制成，有单片和多片包装，并可按客户要求作灭菌处理。
For fabrication, a thin film process of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.
在制作上，根据性能和结构要求，采用了高密度布线、多芯片组装的薄膜工艺。
Low Temperature Co-fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multi-chip modules (MMCM).
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)一种理想的组装技术。
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