• When current flows through a conductor, a magnetic field is formed around the conductor.

    通有电流的导体在其周围会产生磁场。

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  • A via hole is formed in the substrate within the spirally patterned conductor layer, the via hole being formed by through silicon via (TSV).

    介层洞形成于螺旋图案化导体层内部的基材中,该介层洞通过硅通孔技术制成。

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  • C is a second coil formed by a conductor of much larger size and smaller length, wound around and in proximity to coil a.

    是一个次极线圈,由相当大的尺寸和较小的长度构成,环绕与线圈a接近。

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  • Some internal antennas are formed by a plated conductor on a substantially flat circuit board.

    某些内部天线通过充分平坦的电路板上的镀敷导体形成。

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  • Well area extending conductor layers are filled into the opening, and then a virtual bit line which is electrically connected with the well area extending conductor layers is formed on the substrate.

    在开口中填满井区延伸导体层,接着再在基底上形成电连接井区延伸导体层的虚拟位线。

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  • The cable is formed by extruding the foam composition onto a signal carrying conductor and sheathing the foam-coated signal carrying conductor in an appropriate conducting shield.

    将泡沫体组合物挤出到信号携带导体上,并将包覆泡沫体的信号携带导体包封在合适的导电防护套内,从而形成了电缆。

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  • The coil (12) has a cutoff part (13) formed by cutting off at least a part of the conductor.

    线圈(12)具有至少一部分导线被切断的切断部(13)。

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  • In the conductor layer formation step, a single conductor layer including first and second measurement points is formed on a substrate.

    在上述导电体膜形成工序中,在基板上形成包含第一测定部和第二测定部的单一的导电体膜。

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  • A palladium conductor layer is formed on the insulating part from a solution for palladium conductor layer formation which contains a palladium compound, an amine compound, and a reducing agent.

    在绝缘部分上由钯导电体层形成溶液形成钯导电体层,所述溶液含有钯化合物、胺化合物和还原剂。

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  • On the palladium conductor layer is then directly formed a copper deposit by electroplating.

    然后通过电镀在钯导电体层上直接形成铜沉积物。

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  • If the conductor layer has a disconnected portion in the first measurement step, a repairing conductor is formed on the disconnected portion.

    当在上述第一测定工序中判明了在上述导电体膜上存在断线部位时,在该断线部位上形成修补用的导电体。

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  • If the conductor layer has a disconnected portion in the first measurement step, a repairing conductor is formed on the disconnected portion.

    当在上述第一测定工序中判明了在上述导电体膜上存在断线部位时,在该断线部位上形成修补用的导电体。

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