When current flows through a conductor, a magnetic field is formed around the conductor.

通有电流的导体在其周围会产生磁场。

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A via hole is formed in the substrate within the spirally patterned conductor layer, the via hole being formed by through silicon via (TSV).

介层洞形成于螺旋图案化导体层内部的基材中，该介层洞通过硅通孔技术制成。

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C is a second coil formed by a conductor of much larger size and smaller length, wound around and in proximity to coil a.

是一个次极线圈，由相当大的尺寸和较小的长度构成，环绕与线圈a接近。

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