• Three potentials pertinent to various etching techniques are labeled in FIG. 10.

    与各种蚀刻技术有关的三个电势标出在图10中。

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  • Methods: ODO scanning electron microscopy (ODO SEM) and freeze-etching techniques were adopted for the study.

    方法:采用OD O扫描电镜法和冷冻蚀刻法行电镜观察。

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  • This process is repeated multiple times to apply more layers, with careful monitoring and precise etching techniques applied to each layer, to produce the final layered chip design.

    这一过程被重复多次以应用更多的层,通过仔细监测和施加到各个层的精确蚀刻技术,以产生最终的层状芯片设计。

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  • In view oi the problems existing in the silicon micro pressure sensors, this paper proposes the chemical etching techniques and the selective etching processes to control diaphragm thickness.

    并针对硅微压传感元件研制中存在的问题,提出采用化学腐蚀技术,选择性腐蚀工艺控制膜厚。

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  • Stencil manufacturing techniques include chemical etching laser cutting and electroforming.

    钢网制作技术包括化学腐蚀,激光切割和电铸。

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  • Some introductions are conducted on the production techniques, technical characteristics, flows and quality of products in the copper recovery from the waste etching solution.

    介绍了利用含铜蚀刻废液回收铜的生产工艺、技术特点、工艺流程和产品质量。

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  • Some new techniques are adopted, for example, technology of dual-face alignmental silicon etching and anisotropic corrosion (micromachine), etc.

    采用双面对准光刻工艺,各向异性腐蚀微机械加工制硅膜片等新技术。

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  • Course concepts include: concept design. layout. paste-up. and techniques such as engraving. etching. silkscreen. lithography. offset. drawing and cartooning. painting. collage. and computer graphics.

    课程主要包括:概念设计、布局、实施、广告技术,比如雕刻技术、蚀刻、丝网印刷、光刻技术、透印版印刷、绘图和漫画、绘图、拼贴画及计算机绘图。

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  • This paper introduces a fabricated method of using fused silica as the chip material. It includes standard photolithography, wet chemical etching and bonding techniques.

    本文介绍了选用优质石英为芯片基体材料的一种制作方法,关键技术包括标准的光刻,湿法腐蚀,键合等微加工技术。

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  • This paper introduces a fabricated method of using fused silica as the chip material. It includes standard photolithography, wet chemical etching and bonding techniques.

    本文介绍了选用优质石英为芯片基体材料的一种制作方法,关键技术包括标准的光刻,湿法腐蚀,键合等微加工技术。

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