Three potentials pertinent to various etching techniques are labeled in FIG. 10.
与各种蚀刻技术有关的三个电势标出在图10中。
In view oi the problems existing in the silicon micro pressure sensors, this paper proposes the chemical etching techniques and the selective etching processes to control diaphragm thickness.
并针对硅微压传感元件研制中存在的问题,提出采用化学腐蚀技术,选择性腐蚀工艺控制膜厚。
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