• The five company consortium is known as the DA5 (Die Attach 5).

    这五个公司财团是被称为DA5(模具附加5)。

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  • Today, semiconductor products use high-lead containing solder for a die attach material in various devices.

    今天,半导体产品使用高含铅的各种设备,模具材料附着焊锡。

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  • The assembly of MOSFET is consisted of five main processes, which are wafer sawing, die attach, wire bond, molding, trim and form.

    MOSFET的封装主要由晶圆切割,晶粒黏贴,焊线,封塑,切割成型这五大流程组成。

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  • Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation.

    等离子体400和660系列是低压微波等离子体应用于提高模具粘合,引线的焊接,特别是清洗高级的芯片封装。

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  • The elasticity seals completely a valve portal, the hermetic sealing ring can inset on the valve body or attach peripheral at the Die board.

    弹性密封阀门,密封圈可以镶嵌在阀体上或附在蝶板周边。

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  • Specially set structure and attach fine-adjustment protection device, flexible adjustments height and force of cutting, can prolong service life of cutting die and cutting rubber board.

    特有设定构造,附微调保护装置,灵活调设裁断高度和裁断力度,能延长刀模和裁断板的使用寿命。

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  • Specially set structure and attach fine-adjustment protection device, flexible adjustments height and force of cutting, can prolong service life of cutting die and cutting rubber board.

    特有设定构造,附微调保护装置,灵活调设裁断高度和裁断力度,能延长刀模和裁断板的使用寿命。

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