die attach preform 芯片安装用框架
Die Attach Materials 粘晶材料
Direct Die Attach 直接芯片安装
die attach or chip bonding 芯片贴装
Die Attach Epoxy 新型芯片粘合剂
Die Attach Process 贴片工艺示意图
die attach area 芯片粘接区
·2,447,543篇论文数据，部分数据来源于NoteExpress
The five company consortium is known as the DA5 (Die Attach 5).
这五个公司财团是被称为DA5（模具附加5）。
Today, semiconductor products use high-lead containing solder for a die attach material in various devices.
今天，半导体产品使用高含铅的各种设备，模具材料附着焊锡。
The assembly of MOSFET is consisted of five main processes, which are wafer sawing, die attach, wire bond, molding, trim and form.
MOSFET的封装主要由晶圆切割，晶粒黏贴，焊线，封塑，切割成型这五大流程组成。
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