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The five company consortium is known as the DA5 (Die Attach 5).
这五个公司财团是被称为DA5（模具附加5）。
Today, semiconductor products use high-lead containing solder for a die attach material in various devices.
今天，半导体产品使用高含铅的各种设备，模具材料附着焊锡。
The assembly of MOSFET is consisted of five main processes, which are wafer sawing, die attach, wire bond, molding, trim and form.
MOSFET的封装主要由晶圆切割，晶粒黏贴，焊线，封塑，切割成型这五大流程组成。
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