A new type shaped tool is introduced which machines bond of copper, and machining problem about high precision and difference grinding characteristic are resolved.
介绍了加工铜键的一种新型成形刀具，解决了精度要求高耐磨性差的加工难题。
Effective valences of copper in superconducting oxides were calculated from the concept of bond valence.
从键价的概念出发，对氧化物超导体中铜离子的有效电荷进行了计算。
The mounting structure is insulative, and preferably comprises a direct bond to copper board.
该安装结构是绝缘的，并且优选地包括直接接合到铜的板。
Results of analysis with IR and ESCA showed that ring -shaped conjugated structures exist in the films. Copper atom may be linked to the polymer either by covalent bond or coordination bond.
红外光谱和电子能谱的分析结果表明：聚合物薄膜中含有环状共轭结构，铜与聚合物以共 价键、配 位键结合。
A copper foil solution is used to bond the glass pieces together, and then the pieces are soldered together firmly.
铜箔解决方案可使玻璃碎片结合在一起，然后一起焊接牢固。
A copper foil solution is used to bond the glass pieces together, and then the pieces are soldered together firmly.
铜箔解决方案可使玻璃碎片结合在一起，然后一起焊接牢固。
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