The first underfill is filled between the first chip and the second chip in order to wrap the first bump.

以及第一底胶，填充在所述第一芯片与所述第二芯片之间，且包覆所述第一凸块；

youdao

The first underfill is filled between the first chip and the second chip in order to wrap the first bump.

以及第一底胶，填充在所述第一芯片与所述第二芯片之间，且包覆所述第一凸块；

youdao