The first underfill is filled between the first chip and the second chip in order to wrap the first bump.
以及第一底胶,填充在所述第一芯片与所述第二芯片之间,且包覆所述第一凸块;
Specifically, we have to take in this exact amount of energy in order to bump the electron up to higher energy level.
特别的,我们严格需要,这么多,来把电子,提升到更高的能级。
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