Adjusting delay time and gas pressure can reduce the warpage of the part.
工艺上可以通过调整延迟时间和气体压力来减小产品的变形量。
Thickening the wall will help reduce orientation related warpage problems.
增加壁厚将有助于减少因取向引起的翘曲问题。
The speckle projection correlation technique is used to measure the chip warpage.
本文采用投影散斑相关法对芯片翘曲度进行了测量。
Moreover, fast filling and less time for holding were also dedicated to reduce the warpage of product…
适当提高注射速率和减少保压时间也可减小制品翘曲。
An even cooling design becomes very important to control the shrinkage and warpage at an acceptable level.
为了将收缩弯翘控制在可以接受的程度，均衡的冷却设计变得非常重要。
According to the statistical results, the injection time is the most important affecting factor on warpage.
结果表明，注射时间对注塑件翘曲变形的影响最大。
The impact of temperature dependent material property on the warpage of composite shell segment was discussed.
研究了温度敏感性对复合材料开口圆柱层压壳热翘曲变形影响。
All calculations confirm that a compound thickness ratio of 1.2 results in minimal warpage for a large chip TSOP.
所有的计算结果证明化合物厚度比为1.2，会使大芯片TSOP的翘曲问题最小化。
The theory of the Newton ring method is analyzed and the chip warpage is measured by use of the Newton ring method.
分析了牛顿环法的测量原理，利用牛顿环法对芯片翘曲度进行了测量。
Summary:The theory of the Newton ring method is analyzed and the chip warpage is measured by use of the Newton ring method.
分析了牛顿环法的测量原理，利用牛顿环法对芯片翘曲度进行了测量。
If this causes a warpage problem, it sometimes helps to raise the overall water temperature and slow the rate of heat transfer.
如果这样还有翘曲问题，那么升高总的水温并降低热交换速度是有益的。
It produces moldings with good surface finish, is resistant to chemicals and stress cracking, and has low shrinkage and warpage.
它生产的模具表面光洁度好，可耐化学品和应力开裂，并具有低收缩和翘曲。
Sim? ilarly, an increase in case depth, particularly uneven case depth in case hardening steels, increases warpage on quenching.
与此类似，渗碳层厚度越大，特别是对于渗碳层厚度不一的渗碳用钢，淬火时更易产生翘曲。
Changing the wall thickness can have a profound effect on the warpage, depending on the part geometry and the material being molded.
根据零件特征和填充的材料，零件壁厚对翘曲有很重大的影响。
Thus, the semi-insulating nitride semiconductor crystal substrate in which warpage is less and cracking is less likely can be obtained.
由此，能获得其中翘曲较少且较不可能发生破裂的半绝缘氮化物半导体晶体衬底。
A numerical study of residual stresses and warpage was undertaken according to the characteristics of plastic injection molding process.
针对塑料注射成型工艺的特点，提出了残余应力和翘曲变形的数值模拟方法。
Series of glass fiber reinforced PET with low warpage have been prepared according to the mechanism and different methods of reduction of warpage.
依据降低翘曲的机理，选用不同降低翘曲的方法，制备了系列低翘曲玻纤增强PET复合材料。
Therefore, analyzing the warpage of the plastic parts and optimizing their process parameters, is a very effective measure to improve the production quality.
因此对塑件的翘曲变形进行分析并对其注塑工艺参数进行优化，是提高生产质量的一个非常有效的措施。
Based on the experimental phenomena, the effects of various processing parameters on the warpage were summarized, and the mechanism of warpage was also discussed.
归纳实验现象，总结各种因素对翘曲变形的影响规律，并探讨翘曲变形成型机理。
Most injection-molded parts are complicated thin-shell like structure, so the thin shell finite element method is usually used to analyze the warpage and deformation of the parts.
橡塑模具制品一般具有厚度方向尺寸较面内尺寸很小且形状复杂等特点，所以在对制品进行翘曲变形分析时，就可采用薄壳有限元法。
Thermally induced stress and the relevant warpage cause by inappropriate mold design and processing conditions are problems that confounded the overall success of injection molding.
不均匀的热残余应力及其变形是注塑成型加工中常见的工程问题之一。
With comparison to the experimental measurement results, it is found that the linear method is not able to capture the warpage behavior while nonlinear large deformation simulation can.
与实验测量结果相比，线性方法不能反映翘曲形态而非线性大变形仿真能够反映出这种翘曲。
The cause and rule of warpage in the injection-moulding products was introduced. It listed the guarding measures in mold structure, molding technology and forced patterns against warpage.
介绍了注塑制品翘曲变形的原因及其规律。从模具结构、成型工艺、强制定型等方面，列下了避免翘曲变形的措施。
Taking the forming of computer case panel as an example, the process of the filling, cooling and warpage of the plastics parts in the injection molding were simulated by means of MPI software.
以电脑机箱面板为实例，使用MPI软件对塑料件注射过程中的填充、冷却、翘曲情况进行模拟。
Semiconductor analysis with ANSYS tools often incorporates nonlinear behaviors, including package warpage, solder joint creep, fracture in through-silicon-via designs, fatigue and delimitation.
利用ANSYS工具，可以分析半导体的非线性特性，其中包括封装变形、焊接点蠕变以及过孔设计中的断裂、疲劳和层间开裂。
This paper introduces the experimental studies on the warpage of injection molded strip parts in the design of part structure and mold gate and the selecting of molding conditions and materials.
从制品结构和模具浇口设计、原材料和成型条件的优选诸方面对长条形注塑件翘曲变形进行了系统的试验研究。
The principle of precompensation for deformation was presented, which was applied to the shaping of an automobile fan and effectively helped lower the shrinkage deformation and warpage of the product.
介绍了变形预补偿的原理，以汽车风扇为例，成功地降低了汽车风扇的收缩变形和翘曲变形，为解决制品变形问题提供了一条新的思路。
The principle of precompensation for deformation was presented, which was applied to the shaping of an automobile fan and effectively helped lower the shrinkage deformation and warpage of the product.
介绍了变形预补偿的原理，以汽车风扇为例，成功地降低了汽车风扇的收缩变形和翘曲变形，为解决制品变形问题提供了一条新的思路。
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