To introduce a number of polysilicon, wafer supporting projects, such as high purity quartz powder projects, cutting fluid, silicon carbide, cutting line, band saw into the zone.

硅料、硅片生产重要配套项目：如高纯度石英粉产业化项目、切割液、碳化硅、切割线、带锯等。

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The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed.

从全自动划片机的工作机理出发，分析空气静压电主轴、晶圆传输定位、自动对准、自动清洗等全自动划片机的关键技术；

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The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed.

从全自动划片机的工作机理出发，分析空气静压电主轴、晶圆传输定位、自动对准、自动清洗等全自动划片机的关键技术；

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