The high density packaging technology for LSI becomes more and more important as LSI and VLSI are developing rapidly.
随着LSI和VLSI的飞速发展,LS I高密度封装技术变得越来越重要。
Developing flow of very large scale integrated (VLSI) circuits is divided into four main steps: designing, manufacturing, testing and packaging.
超大规模集成(VLSI)电路产品的开发流程主要包括设计、制造、测试和封装四个步骤。
Developing flow of very large scale integrated (VLSI) circuits is divided into four main steps: designing, manufacturing, testing and packaging.
超大规模集成(VLSI)电路产品的开发流程主要包括设计、制造、测试和封装四个步骤。
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