The high density packaging technology for LSI becomes more and more important as LSI and VLSI are developing rapidly.

随着LSI和VLSI的飞速发展，LS I高密度封装技术变得越来越重要。

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Developing flow of very large scale integrated (VLSI) circuits is divided into four main steps: designing, manufacturing, testing and packaging.

超大规模集成(VLSI)电路产品的开发流程主要包括设计、制造、测试和封装四个步骤。

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