Familiar with deep submicron process design rule.
熟悉深亚微米工艺设计规则。
In this article, deep submicron lithography and nano processing are reviewed.
本文综述了深亚微米光刻和纳米光刻技术。
With deep submicron technology, crosstalk noise becomes more and more serious.
随着深亚微米技术，串扰噪声问题越来越严重。
This paper introduces a novel submicron etching technology for emitter window.
介绍了一种新的亚微米发射极窗口刻蚀工艺。
The classifier can be used for classifying powders of micron or submicron size.
结果表明，该超细粉分级机可用于微米或亚微米级的粉体分级。
High frequency vibration removes submicron particle instantly without damaging wafers.
高频振动去除亚微米颗粒即刻不损坏晶圆。
It is difficult for traditional measuring methods to attain the level of submicron error.
传统的球度测量方法很难达到亚微米级的测量准确度。
Experimental results of deep submicron lithography with a excimer laser are reported in this paper.
报道用远紫外准分子激光进行亚微米光刻的实验结果。
Submicron particle sizing methods and techniques are difficult problems in particle research field.
超细颗粒的测量方法和测试技术则是颗粒研究领域的热点。
The process of submicron resin adsorption is a kind of rapid reaction, so it is difficult to monitor.
亚微米树脂吸附反应是一种快速反应，离线取样分析较困难。
Interconnect wire delay is a very important question that must to be resolved in deep submicron IC design.
深亚微米集成电路的互连线延迟是设计中需十分重视并必须解决的问题。
This paper presents the building procedures of hydrodynamic model for submicron semiconductor device simulation.
主要讨论了亚微米半导体器件模拟的流体动力学模型方程的建立过程。
Moreover, their submicron size and their large specific surface area favor their absorption compared to larger carriers.
而且，相比其他尺寸大的载体，聚合物纳米胶束亚微型尺寸和较大的特殊表面，可以支持吸附。
In some embodiments, the release layer is formed from a dispersion of submicron particles that are coated onto a substrate.
在一些实施例中，所述释放层是由涂布于基板上的亚微米粒子的分散液形成。
Pulverizer of turbulence was researched in this thesis, by which several materials submicron superfine powder were prepared.
本文以湍流式超细粉碎机为研究对象，利用该机制取了几种材料的亚微米级超细粉体。
The latest advance of the dry etching for submicron fabrication in ULSI production and interrelated technology are introduced.
综述了亚微米、深亚微米干法刻蚀和相关技术的最新进展及其在超大规模集成电路制造中的应用。
It is studied that milling time, carbon content, inhibitor and sintering effect on properties of the submicron cemented carbides.
研究了球磨时间、碳含量、抑制剂以及烧结对超细硬质合金性能的影响。
Then, the influence of deep-submicron technology on IDDQ testing is explained. And the improved IDDQ testing methods are also given.
分析了深亚微米技术对IDDQ测试的影响以及IDDQ的改进方法。
Since deep submicron manufacturing process is widely used in microprocessors, transient faults have become the main source of chip faults.
随着深亚微米工艺的广泛应用，瞬态故障已成为芯片失效的主要原因。
The fabrication of submicron vertical silicon screen is a key step for fabricating Josephsonjunction coupled by vertical silicon membrane.
亚微米垂直硅墙的制备是垂直硅薄膜耦合约瑟夫逊结的关键工艺。
When the characteristic size reach micron, submicron degree, overcoming the "limit" binding in order to increase the integration of device.
当特征尺寸进入到微米、亚微米量级时，需要克服“极限”束缚，增加器件的集成度。
Pleotiful toxic trace elements enrich in submicron particles let by coal combustion, whichposed a serious threat on air environment and human health.
燃煤产生的细粒子富集了大量的有毒痕量元素，对大气环境和人类健康造成严重危害。
Optical rotation technology has been used in many fields as manipulating a single micron, submicron particles, and has broad prospects for development.
光致旋转技术已经在很多领域被用来作为操纵单个微米、亚微米级微粒，具有广阔的发展前景。
The deep submicron technology presents lots of new challenges to the physical design of VLSI and new techniques are needed in the back-end design flow.
深亚微米下芯片的物理设计面临很多挑战，特别是对于超大规模电路，在后端设计流程上要有新的方法。
In this study, we characterized the submicron microstructure of arterial wall collagen and elastin to evaluate its potential role in regional LDL deposition.
在本研究中，我们通过研究胶原和弹性蛋白的亚微结构来评估低密度脂蛋白局部沉积的潜在作用。
The experimental results show that submicron level plane positioning accuracy can be achieved by the precision positioning device based on laser Moire signal.
实验结果表明，基于激光莫尔信号的精密定位装置可获得亚微米级的平面定位精度。
On the other hand may cause the material to have the big plastic deformation, improving material tissues, obtaining the submicron even nanometer bulk materials.
另一方面可以使材料产生较大的塑性变形，改善材料的内部组织，获得亚微米级甚至纳米级块体材料。
They provide outstanding reduction of virus, bacteria, cysts, endotoxin and many other submicron particles through both electro-adhesion and mechanical processes.
他们可以通过电子粘附和机械工艺显著减少病毒、细菌、胞囊和很多其他的亚微颗粒。
They provide outstanding reduction of virus, bacteria, cysts, endotoxin and many other submicron particles through both electro-adhesion and mechanical processes.
他们可以通过电子粘附和机械工艺显著减少病毒、细菌、胞囊和很多其他的亚微颗粒。
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