The experimental results show that submicron level plane positioning accuracy can be achieved by the precision positioning device based on laser Moire signal.
实验结果表明，基于激光莫尔信号的精密定位装置可获得亚微米级的平面定位精度。
Compared with the prior art, the method can process the high polymer into submicron particles, and the particles which have uniformly distributed granular diameters are regularly spherical.
与现有技术相比，本发明能够使高聚物加工成亚微米级的粒子， 且粒子粒径分布均一，呈规整球形。
This paper introduces a novel submicron etching technology for emitter window.
介绍了一种新的亚微米发射极窗口刻蚀工艺。
The classifier can be used for classifying powders of micron or submicron size.
结果表明，该超细粉分级机可用于微米或亚微米级的粉体分级。
It is difficult for traditional measuring methods to attain the level of submicron error.
传统的球度测量方法很难达到亚微米级的测量准确度。
Experimental results of deep submicron lithography with a excimer laser are reported in this paper.
报道用远紫外准分子激光进行亚微米光刻的实验结果。
The process of submicron resin adsorption is a kind of rapid reaction, so it is difficult to monitor.
亚微米树脂吸附反应是一种快速反应，离线取样分析较困难。
Interconnect wire delay is a very important question that must to be resolved in deep submicron IC design.
深亚微米集成电路的互连线延迟是设计中需十分重视并必须解决的问题。
This paper presents the building procedures of hydrodynamic model for submicron semiconductor device simulation.
主要讨论了亚微米半导体器件模拟的流体动力学模型方程的建立过程。
A new detecting technique-correction technique for datum in submicron DSW is introduced from the basic point of view.
本文从最基本的角度出发，介绍了亚微米分步重复投影光刻机中的一项新的检测技术——基准校正技术。
In some embodiments, the release layer is formed from a dispersion of submicron particles that are coated onto a substrate.
在一些实施例中，所述释放层是由涂布于基板上的亚微米粒子的分散液形成。
The invention relates to a low temperature solid phase synthesis method of hexagonal phase nickel purite submicron crystal.
本发明涉及一种六方相硫化镍亚微米晶的低温固相合成方法。
The latest advance of the dry etching for submicron fabrication in ULSI production and interrelated technology are introduced.
综述了亚微米、深亚微米干法刻蚀和相关技术的最新进展及其在超大规模集成电路制造中的应用。
Then, the influence of deep-submicron technology on IDDQ testing is explained. And the improved IDDQ testing methods are also given.
分析了深亚微米技术对IDDQ测试的影响以及IDDQ的改进方法。
Since deep submicron manufacturing process is widely used in microprocessors, transient faults have become the main source of chip faults.
随着深亚微米工艺的广泛应用，瞬态故障已成为芯片失效的主要原因。
The fabrication of submicron vertical silicon screen is a key step for fabricating Josephsonjunction coupled by vertical silicon membrane.
亚微米垂直硅墙的制备是垂直硅薄膜耦合约瑟夫逊结的关键工艺。
Abstract: It is studied that milling time, carbon content, inhibitor and sintering effect on properties of the submicron cemented carbides.
文摘：研究了球磨时间、碳含量、抑制剂以及烧结对超细 硬质合金性能的影响。
Modern methods for particle sizing are stated and analyzed. Some problems are discussed when these methods are used for submicron particles.
笔者分析并综述了现代颗粒测试的方法和技术 ，讨论了这些方法应用于亚微米级超细颗粒的测量时存在的问题和局限。
The deep submicron technology presents lots of new challenges to the physical design of VLSI and new techniques are needed in the back-end design flow.
深亚微米下芯片的物理设计面临很多挑战，特别是对于超大规模电路，在后端设计流程上要有新的方法。
In this study, we characterized the submicron microstructure of arterial wall collagen and elastin to evaluate its potential role in regional LDL deposition.
在本研究中，我们通过研究胶原和弹性蛋白的亚微结构来评估低密度脂蛋白局部沉积的潜在作用。
The research result of this paper has some directive meaning and applicable value in physical design and optimization for VLSI under deep-submicron technology.
本文的研究结果对于深亚微米工艺下的大规模物理设计与优化，具有一定的指导意义和应用价值。
Due to the large load capacitance and increasingly serious inter-wire coupling, deep submicron buses are facing many problems like power, delay and reliability.
大的负载电容和日益严重的线间耦合使得深亚微米总线面临着功耗、延迟和可靠性等问题。
They provide outstanding reduction of virus, bacteria, cysts, endotoxin and many other submicron particles through both electro-adhesion and mechanical processes.
他们可以通过电子粘附和机械工艺显著减少病毒、细菌、胞囊和很多其他的亚微颗粒。
This paper introduces a new method that measures Brownian movement track and particles size of submicron particles according to Langevin s Brownian movement theory.
本文介绍了以朗之万的布朗运动模型理论为依据测量超细颗粒布朗运动与粒径关系的一种新方法。
The reunion reason of boron carbide submicron powders in manufacturing process was analyzed, spray drying and airflow crash were adopted to deal with the materials.
对碳化硼超细微粉在干燥时的硬团聚现象进行了分析，并分别采用喷雾干燥和气流破碎两种方法对物料进行处理。
In deep submicron era, IC design in physical design has more and more challenge, with the increasing design scale, faster clock frequency and minimizing process dimension.
在深亚微米时代，随着设计规模变大，时钟频率越来越高以及工艺尺寸的减小，IC物理设计面临着诸多困难。
In deep submicron era, IC design in physical design has more and more challenge, with the increasing design scale, faster clock frequency and minimizing process dimension.
在深亚微米时代，随着设计规模变大，时钟频率越来越高以及工艺尺寸的减小，IC物理设计面临着诸多困难。
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