There is only a small influence of the bond frame width of glass solder on the thermal stress.
玻璃焊料线宽对热应力影响不大，厚度和键合温度越大热应力越大。
Consequently, the solder can be formed on or adhered to the first posts by placing the wafer having pre-formed solder onto the first posts.
从而，通过将包括预成型的焊料的晶片放置在所述多个第一柱上，而使得所述焊料可以形成在或者粘附在所述多个第一柱上。
You can either solder them together properly with a metal strip on the front, or just try positioning the metal correctly inside the case with the cells.
你可以使用前面的金属条将他们焊在一起，或者只是定位好电池盒里面的电池单元的金属条。
In addition, the solder mask coating on printed circuit board, with the plasma treatment, can also obtain certain roughness and high active surface, thus improving the solder coating adhesion.
另外，在阻焊膜涂覆前，用等离子体对印制电路板面处理一下，还可获得一定的粗糙度和高活性的表面，从而提高阻焊膜层的附着力。
The welding quality of the solder joint on the conducting wire connected with the soldering cover and the PCB.
导线在接插件焊杯内的焊点和导线在印制板上的焊点的焊接质量。
The text on the solder mask layer is overlapping the text that on the circuit layer. We suggest move it away. Please refer to Q7.
绿油层上的字符与线路上的字符重叠在一起，建议将绿油层上的字符移开。请看Q7处。
Is the temperature verified on the solder pot before coupons are thermal stressed?
在热应力测试之前是否确认锡炉的温度？
The use of nitrogen will depend on the solder paste flux chemistry.
是否使用氮气取决于焊锡膏焊剂的化学特性。
Through non-linear finite analysis , the dependence of fatigue life of solder joint on thermomechanical properties of underfill was calculated.
通过非线性有限元分析，计算出焊点疲劳寿命对下部填充料基本热力学性质的依赖关系。
Solder powder is the main component of solder paste, and the quality of paste print mostly depend on the solder powder.
焊锡粉是焊锡膏的主要成分，其质量的好坏对焊锡膏的印刷质量起着至关重要的作用。
Then which solder is best fit for this model and the influence on fatigue of solder are known, when free-lead solder is used.
随后得出了不同焊料在此模型中的适用性及无铅工艺对焊点可靠度的部分影响。
Solder is sequentially formed on the first posts.
接 着在多个第一柱上形成焊料。
An adhesive must withstand the environment of hot solder, fluxing and cleaning, it may not have an electrical effect on the circuit.
胶粘剂必须能适应使用高温焊料及助焊剂、清洗剂时的环境，还不能影响电路的性能。
As to the complicated solder design in the engineering practice, the rationality of the design can be judged based on the factors of solder by the network method.
在实际工程中对于复杂的焊缝设计，利用神经网络的方法输入影响焊缝的主要因素，即可判断设计是否可靠。
The research on element interdiffusion, reaction and microstructure at the interface of solder joints is vital to the study of lead free solder joints reliability.
因此钎焊过程和服役过程中界面的反应、扩散以及界面的微观组织对当前无铝钎料可靠性研究具有重大意义。
The text on the two solder mask layer is same, we will cancel the text that on this solder mask layer, please refer to Q9.
此层上的字符与另一层绿油上的字元相同，请确认是否可以取消此层上的该字符。请看Q9处。
In this technique, the component side of the board is dedicated to the ground plane, and signal traces are placed on the solder side.
采用这种技术时，电路板的元件侧专用于接地层，信号走线则布设在焊接侧。
The reliability of solder interconnections is dependable on the dynamic response of the board-level package.
为板级封装动态响应分析和焊料微互连应力分析提供了基础。
Screen Print: Solder mask coating will cover completely the panel holes, pads and traces, on both sides.
网印：在板两面完全涂覆阻焊油墨，包括导通孔、焊盘。
It specifies the influence of the parameters of solder paste printing, printing cycle, ease operation of software and additional steps of cleaning and inspection on improving the quality of products.
阐述了锡膏印刷工艺参数，印刷周期，操作软件的易用性，以及清洗、检验等附加工序对实际生产量的影响。
The effect of gas hole location on SMT solder joint fatigue life has been analyzed by finite element method .
分析发现，与无缺陷焊点相比，气孔使焊点中应力应变分布发生了改变，使焊点疲劳寿命缩短；
When solder bumps (22) on the die are reflowed, the fluxing agent ACTS to remove any oxides present on the solderable surfaces of the substrate or the die.
当管芯上的焊料突点(22)被回流时，该助焊剂的作用是清除基板或管芯的可焊接表面上存在的任何氧化物。
At the same time, experiments on PBGA solder ball laser reflow were carried out.
同时，本文还对PBGA钎料球激光重熔进行了试验研究。
Basic 2-d transmission X-ray systems are typically used to analyze solder joints on single-sided boards.
基本的第2个传输X -射线系统在单边的委员会典型地用于分析焊剂联接。
Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.
介绍了激光重熔在面阵列封装钎料凸点成形中的研究进展，并且对PBGA共晶钎料球激光重熔进行了工艺研究。
Furthermore, the effect of solder ball layout and stress relax buffer layer material on the fatigue life of solder joints is studied.
最后探测锡球配置方式和缓冲层材料性质对于锡球疲劳寿命的影响，以获得高可靠度的封装结构。
Furthermore, the effect of solder ball layout and stress relax buffer layer material on the fatigue life of solder joints is studied.
最后探测锡球配置方式和缓冲层材料性质对于锡球疲劳寿命的影响，以获得高可靠度的封装结构。
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