There is only a small influence of the bond frame width of glass solder on the thermal stress.
玻璃焊料线宽对热应力影响不大，厚度和键合温度越大热应力越大。
In addition, the solder mask coating on printed circuit board, with the plasma treatment, can also obtain certain roughness and high active surface, thus improving the solder coating adhesion.
另外，在阻焊膜涂覆前，用等离子体对印制电路板面处理一下，还可获得一定的粗糙度和高活性的表面，从而提高阻焊膜层的附着力。
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