• Making method of high deep-width rate, batch production of planar windings with LIGA process and silicon deep etching process is researched .

    深入地研究了LIGA工艺深刻工艺为主平面绕阻高深宽比、批量化制作方法

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  • A tunneling accelerometer is fabricated and characterized based on the extension of the silicon-glass anodic-bonding and deep etching releasing process provided by Peking University.

    提出一种基于北京大学硅玻璃键合深刻释放工艺扩展工艺,用来加工微型隧道加速度计。

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  • This accelerometer is fabricated by N type silicon wafer. To obtain high aspect ratio structure, deep reactive ion etching(DRIE) process is employed.

    加速度普通的N硅片制造,为了刻蚀高深宽结构,使用了深反应离子刻蚀(DRIE工艺

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  • This accelerometer is fabricated by N type silicon wafer. To obtain high aspect ratio structure, deep reactive ion etching(DRIE) process is employed.

    加速度普通的N硅片制造,为了刻蚀高深宽结构,使用了深反应离子刻蚀(DRIE工艺

    youdao

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